Composite board package structure

A composite board package structure, comprising:

• a first ceramic board having an inner surface and an outer surface that is opposite to the inner surface;
• a plurality of conductive pillars embedded in the first ceramic board, wherein each of the conductive pillars has an inner contact that is exposed from the inner surface and an outer contact that is exposed from the outer surface;
• a plurality of connection pads formed on the outer surface of the first ceramic board, wherein the connection pads are respectively connected to the outer contacts of the conductive pillars;
• a plurality of layout circuits formed on the inner surface of the first ceramic board and respectively connected to the inner contacts of the conductive pillars;
• a photosensitive photoresist wall being ring shaped and formed on the inner surface of the first ceramic board, wherein the photosensitive photoresist wall is surroundingly arranged at an outer side of the layout circuits;
• a photosensitive photoresist layer bonded onto the photosensitive photoresist wall, wherein the photosensitive photoresist layer, the photosensitive photoresist wall, and the first ceramic board jointly define an enclosed space that accommodates the layout circuits therein;
• and
• a second ceramic board bonded to the photosensitive photoresist layer.

A composite board package structure, comprising:

• a ceramic board having an inner surface and an outer surface that is opposite to the inner surface, wherein the ceramic board has an input hole penetrating therethrough;
• a thin film disposed on the inner surface of the ceramic board and defining a plurality of bubble formation regions;
• a photosensitive photoresist wall being ring-shaped and formed on the thin film;
• and
• a layout board having a plurality of output holes penetrating therethrough, wherein the layout board is bonded to the photosensitive photoresist wall, and the layout board, the photosensitive photoresist wall, the thin film, and the ceramic board jointly define an accommodating space that is in spatial communication with the input hole and the output holes;
• wherein the output holes respectively correspond in position to the bubble formation regions of the thin film, such that when the accommodating space of the composite board package structure receives liquid passing through the input hole, any one of the bubble formation regions of the thin film is configured to selectively form a bubble that pushes the liquid to extrude a droplet by passing through a corresponding one of the output holes.