Antenna for mm-wave signal transmission
AssigneeNXP B.V.
InventorsMustafa Acar, Rajesh Mandamparambil, Mark Pieter van der Heijden
Life of this patent
Estimating the term…
Abstract
An electronic device realizes an antenna-in-package (AiP). The device includes a first die having a first metal layer that defines an antenna patch, a second metal layer that defines a parasitic patch above and vertically aligned with the antenna patch, and an amplifier having an output terminal electrically coupled to the antenna patch. The device further includes a second die having a metal layer that defines a reflecting patch and an interconnect that joins the first die with the second die in a vertical stack with the first die above the second die such that the antenna patch is spaced apart from, parallel to, and vertically aligned with the reflecting patch.
Claims20
An electronic device, comprising:
- a first die having a first metal layer that defines an antenna patch, a second metal layer that defines a parasitic patch above and vertically aligned with the antenna patch, and an amplifier having an output terminal electrically coupled to the antenna patch;
- a second die having a metal layer that defines a reflecting patch;
- and
- an interconnect that joins the first die with the second die in a vertical stack with the first die above the second die such that the antenna patch is spaced apart from, parallel to, and vertically aligned with the reflecting patch.
A semiconductor die, comprising:
- a first metal layer that defines an antenna patch on a first surface of the die;
- a second metal layer that defines a parasitic patch on a second, opposite surface of the die, the parasitic patch vertically aligned with and parallel to the antenna patch;
- a conductive shield that at least partially laterally surrounds the parasitic patch;
- and
- an amplifier having an output terminal electrically coupled to the antenna patch.
An electronic device, comprising:
- a first die having a metal layer that defines an antenna patch;
- a second die having a metal layer that defines a reflecting patch;
- and
- an interconnect that joins the first die with the second die in a vertical stack such that the antenna patch is spaced apart from, parallel to, and vertically aligned with the reflecting patch.
Dependencies are inferred from the claim text.