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AssigneeSamsung SDI Co., Ltd.
InventorsYoungjin JANG, Jinhong LEE, JungHun CHOI
Estimating the term…
The present disclosure relates to a die apparatus for manufacturing a secondary battery and a link-type knockout unit for the die apparatus. The die apparatus for manufacturing a secondary battery includes a lower die that supports an electrode plate and has one or more scrap discharge holes, an upper die positioned above the lower die and including a punch corresponding to each of the scrap discharge holes, and a knockout unit including a pad vertically moving inside the scrap discharge hole and a pad support that supports the pad upward and allows the pad to apply a reaction force corresponding to a downward pressure of the punch to a bottom surface of the electrode plate when the punch moves downward.
An apparatus, comprising:
A knockout unit for an apparatus comprising a lower die and an upper die, the lower die configured to support an electrode plate, the lower die comprising a scrap discharge hole, the upper die positioned above the lower die, and the upper die comprising a punch corresponding to the scrap discharge hole, wherein the knockout unit is configured to apply a reaction force corresponding to a downward pressure of the punch to a bottom surface of the electrode plate upon the punch moving downward.
Dependencies are inferred from the claim text.