Micro-sized metamaterial absorbers
AssigneeViavi Solutions Inc.
InventorsVladimir P. RAKSHA, Paul T. KOHLMANN
Life of this patent
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Abstract
In some implementations, a metamaterial absorber (MMA) is configured to absorb a particular range of electromagnetic radiation. The MMA includes a first metal or semiconductor material; a dielectric material disposed on the first metal or semiconductor material; and a second metal material disposed on the dielectric material. A length dimension associated with the MMA is less than or equal to 200 micrometers (μm), a width dimension associated with the MMA is less than or equal to 200 μm, and a thickness dimension associated with the MMA is less than or equal to 8 μm.
Claims20
A metamaterial absorber (MMA) to absorb a particular range of electromagnetic radiation, comprising:
- a first metal or semiconductor material;
- a dielectric material disposed on the first metal or semiconductor material;
- and
- a second metal or semiconductor material disposed on the dielectric material, wherein:
- the second metal or semiconductor material is different from the first metal or semiconductor material,
- the particular range of electromagnetic radiation is between 300 micrometers (μm) and 10 centimeters (cm), and
- at least one of:
- a length dimension associated with the MMA is less than or equal to 200 micrometers (μm),
- a width dimension associated with the MMA is less than or equal to 200 μm, or
- a thickness dimension associated with the MMA is less than or equal to 8 μm.
A coating disposed on a surface of a component, comprising:
- a layer that includes a plurality of metamaterial absorbers (MMAs) disposed within a binder,
- wherein each MMA, of the plurality of MMAs, comprises:
- a first metal or semiconductor material,
- a dielectric material disposed on the first metal or semiconductor material, and
- a second metal or semiconductor material disposed on the dielectric material;
- wherein at least one of:
- a length dimension associated with each MMA is less than or equal to 200 micrometers (μm),
- a width dimension associated with each MMA is less than or equal to 200 μm, or
- a thickness dimension associated with each MMA is less than or equal to 8 μm;
- and
- wherein the plurality of MMAs includes a first MMA and a second MMA that is oriented oblique relative to the first MMA.
A method, comprising:
- depositing, by a deposition system, a release material on a substrate,
- wherein the substrate is embossed with a plurality of unit cells;
- depositing, by the deposition system, a first metal or semiconductor material on the release material;
- depositing, by the deposition system, a dielectric material on the first metal or semiconductor material;
- and
- depositing, by the deposition system, a second metal material on the dielectric material, wherein:
- the second metal material is different from the first metal or semiconductor material,
- the second metal material is a magnetic metal material,
- portions of the first metal or semiconductor material, the dielectric material, and the second metal material that are respectively deposited on the plurality of unit cells form a plurality of metamaterial absorbers (MMAs), and
- at least one of:
- a length dimension associated with each MMA, of the plurality of MMAs, is less than or equal to 200 micrometers (μm),
- a width dimension associated with each MMA, of the plurality of MMAs, is less than or equal to 200 μm, or
- a thickness dimension associated with each MMA, of the plurality of MMAs, is less than or equal to 8 μm.
Dependencies are inferred from the claim text.