Plasma-based glass package dicing

Abstract

According to the various aspects, a method is provided for dicing a semiconductor panel having a glass core with topside build-up (BU) layers, backside BU layers, and interconnects. In an aspect, a hard mask is deposited on the semiconductor panel and patterned to form openings for a plurality of cut-streets. In an aspect, the dicing of the semiconductor panel includes using plasma dicing steps to form cut-streets through the topside BU layers and the backside BU layers, and using a mechanical sawing step or plasma dicing step to cut through the glass core. In another aspect, the dicing of the semiconductor panel further includes using an acid rinse to remove metal salts when cutting through the glass core during the plasma dicing step. In another aspect, a singulated die may have a first BU sidewall and a second BU sidewall having a morphology that includes semi-sphere fillers.

Dependencies are inferred from the claim text.