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AssigneeKioxia Corporation
InventorsAi MORI, Hiroaki ASHIDATE, Yoshiharu ONO, Jun TAKAGI, Kohei NAKAMURA, Tomohiko MINAMI
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According to some embodiments, provided is a separation system configured to separate a bonded substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate. The separation system includes a first chuck configured to hold the first substrate of the bonded substrate. The separation system includes a second chuck configured to hold the second substrate of the bonded substrate and move the second substrate in a first direction away from a plate surface of the first substrate. The separation system includes an adjuster configured to adjust a tilt of the second chuck with respect to a direction perpendicular to a set line set on a holding surface of the second substrate of the second chuck. The separation system includes a controller configured to operate the adjuster to maintain symmetrical progression of the separation relative to the set line.
A separation system configured to separate a bonded substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate, the separation system comprising:
A separation method executed by a separation system configured to separate a bonded substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate, the separation method comprising:
Dependencies are inferred from the claim text.