Mold
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorMineo KOGA
Life of this patent
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorMineo KOGA
Estimating the term…
A mold of an embodiment includes a plunger, a cull, a plurality of cavities, and a plurality of runners. The plunger is provided inside an opening of one of upper and lower dies to be movable forward and backward in the up and down direction. The cull is provided on the other of the upper and lower dies to face the opening. The cavity is capable of receiving a semiconductor chip. The plurality of runners connect the cull to the plurality of cavities. The cull includes a plurality of first flow passages and a plurality of second flow passages. The first flow passage extends from a center toward a connection position with the plurality of runners. The second flow passage extends in a circumferential direction centered on the center. The second flow passage surrounds the plurality of first flow passage. The second flow passage is connected to the plurality of first flow passage.
A mold comprising:
Dependencies are inferred from the claim text.