# US 2026/0076276 A1 · Solderless and pressure contact connection

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2026/0076276 A1
- Document ID: US20260076276A1
- Status: Published application
- Kind: A1
- Application number: 19/391,134
- Filed: 2025-11-17
- Published: 2026-03-12
- Earliest claimed: 2022-07-12
- Assignees: Littelfuse, Inc.
- Applicants: Littelfuse, Inc.
- Inventors: Tiburcio A. Maldo; Rhodri Hughes; Robert Ebido; Jeff Grozen; Josef Colquin A. Chua; Domingo Atienza, JR.
- Web page: https://patentgrep.com/patent/US20260076276A1

## CPC

- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/658: {for devices provided for in groups H10D8/00 - H10D48/00}
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A pressure contact assembly includes a power substrate, a chip, and a lead. The power substrate has a surface connected to a ceramic tile and a cavity. The chip is soldered to the surface. The lead is to be inserted into the cavity and has a top portion to connect to an external device and a bottom portion to fit into the cavity.

## Claims

### Claim 1

A pressure contact assembly comprising:
a power substrate comprising a first surface coupled to a ceramic tile, the first surface comprising a first cavity;
a chip soldered onto the first surface; and
a lead to be inserted into the first cavity, the lead comprising:
a top portion to connect to an external device; and
a bottom portion with a modified portion to fit into the first cavity.

### Claim 2 (depends on 1)

The pressure contact assembly of claim 1, wherein the modified portion includes a coining u-shaped.

### Claim 3 (depends on 2)

The pressure contact assembly of claim 2, wherein the modified portion includes a spring contact, and wherein pressure is applied to the spring contact to fit the coining u-shape into the first cavity.

### Claim 4 (depends on 1)

The pressure contact assembly of claim 1, wherein the modified portion includes a button.

### Claim 5 (depends on 1)

The pressure contact assembly of claim 1, wherein the modified portion includes a deformation.

### Claim 6 (depends on 1)

The pressure contact assembly of claim 1, the first surface further comprising:
a second cavity; and
an under-etch disposed between the first cavity and the second cavity,
wherein pressure is applied to the under-etch to fasten the lead into the power substrate.

### Claim 7 (depends on 1)

The pressure contact assembly of claim 1, wherein the modified portion includes an aperture, wherein the first cavity is an under-etch comprising a rectangular cutout of the first surface that does not expose the ceramic tile, wherein the first surface includes an over-etch cut through the first surface until the ceramic tile is visible, wherein the first surface includes a circular portion between the under-etch and the over-etch, and wherein the aperture fits over the circular portion to fasten the lead into the power substrate.

### Claim 8 (depends on 1)

The pressure contact assembly of claim 1, wherein the ceramic tile is visible at the first cavity.

### Claim 9 (depends on 1)

The pressure contact assembly of claim 1, further comprising:
a second surface,
wherein the ceramic tile is sandwiched between the first surface and the second surface.

### Claim 10 (depends on 9)

The pressure contact assembly of claim 9, wherein the power substrate is a direct copper bonded substrate.

### Claim 11 (depends on 9)

The pressure contact assembly of claim 9, wherein the power substrate is an active metal brazed substrate.

### Claim 12 (depends on 1)

The pressure contact assembly of claim 1, wherein the power substrate is an insulated metal substrate.

### Claim 13

A pressure contact assembly comprising:
a power substrate comprising a first surface coupled to a ceramic tile, the first surface comprising a cavity; and
a lead comprising:
a first portion to connect to an external device; and
a second portion coupled to the first portion, the second portion being perpendicular to the first portion, and the second portion comprising a modification, wherein the modification is press-fit into the cavity.

### Claim 14 (depends on 13)

The pressure contact assembly of claim 13, wherein the modification is selected from a group consisting of a coining u-shape, a button, a deformation causing a protrusion, a center cut resulting in a pair of feet, and an aperture.

### Claim 15 (depends on 13)

The pressure contact assembly of claim 13, wherein the cavity is selected from a group consisting of an over-etch, an under-etch, and a half-etch.

### Claim 16 (depends on 13)

The pressure contact assembly of claim 13, wherein the power substrate is selected from a group consisting of a direct copper bonded substrate, an active metal brazed substrate, and an insulated metal substrate.

### Claim 17 (depends on 13)

The pressure contact assembly of claim 13, wherein the ceramic tile is Silicon Nitride (Si3N4).