# US 2026/0076263 A1 · Method of assembling an electroacoustic component to an electronic circuit by reflow soldering > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0076263 A1 - Document ID: US20260076263A1 - Status: Published application - Kind: A1 - Application number: 19/319,329 - Filed: 2025-09-04 - Published: 2026-03-12 - Earliest claimed: 2024-09-11 - Applicants: Vermon - Inventors: Nicolas PORCHER; Quorentin COLAS - Web page: https://patentgrep.com/patent/US20260076263A1 ## CPC - H10W 72/012: {of bump connectors, dummy bumps or thermal bumps} - H10W 90/00: Package configurations - H10W 72/019: {of bond pads} - H10W 72/072: {of bump connectors} - H10W 72/07233: {Ultrasonic bonding, e.g. thermosonic bonding} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/29: Bond pads specially adapted therefor - H10W 72/01223: {in liquid form, e.g. by dispensing droplets or by screen printing} - H10W 72/07236: {Soldering or alloying} - H10W 72/222: {Multilayered bumps, e.g. a coating on top and side surfaces of a bump core} - H10W 72/232: {Plan-view shape, i.e. in top view} - H10W 72/242: {relative to the surface, e.g. recessed, protruding} - H10W 72/923: {Bond pads having multiple stacked layers} - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 90/721: {of bump connectors} - H10W 90/722: {between stacked chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present description concerns a method of manufacturing an ultrasonic device comprising an electronic circuit and an electroacoustic component, the method comprising the forming of first connection pads bonded to a plate comprising one electroacoustic component or a plurality thereof, the forming of solder balls on the first pads, the melting of the solder balls so that they adhere to the first pads, optionally the cutting of the plate to separate the electroacoustic components, the forming of second connection pads bonded to the electronic circuit, the application of the electroacoustic component to the electronic circuit so that the solder balls come into contact with the second pads, and the melting of the solder balls so that they adhere to the first pads and to the second pads. ## Claims ### Claim 1 Method of manufacturing an ultrasonic device comprising an electronic circuit and an electroacoustic component, the method comprising the following steps: forming first connection pads bonded to a plate comprising one electroacoustic component or a plurality thereof; forming solder balls on the first connection pads; melting the solder balls so that they adhere to the first connection pads; optionally cutting the plate to separate the electroacoustic components; forming second connection pads bonded to the electronic circuit; applying the electroacoustic component to the electronic circuit so that the solder balls come into contact with the second connection pads; and melting the solder balls again so that they adhere to the first connection pads and to the second connection pads. ### Claim 2 (depends on 1) Method according to claim 1, wherein each first connection pad comprises a stack of a bonding layer, of a metal layer, and of a finishing layer, the metal layer being interposed between the bonding layer and the finishing layer, the bonding layer being in direct physical contact with the electroacoustic component and the metal layer, and the finishing layer being in direct physical contact with the metal layer. ### Claim 3 (depends on 2) Method according to claim 2, wherein the bonding layer is made of chromium or of a chromium alloy. ### Claim 4 (depends on 2) Method according to claim 2, wherein the metal layer is made of copper. ### Claim 5 (depends on 2) Method according to claim 2, wherein the finishing layer is made of gold. ### Claim 6 (depends on 1) Method according to claim 1, wherein the electroacoustic component comprises a tungsten carbide coating, the first connection pads being in direct physical contact with the coating. ### Claim 7 (depends on 6) Method according to claim 6, wherein the plate comprises a surface having the first connection pads resting thereon, the method comprising the forming of the tungsten carbide coating over the entire surface and the removal of portions of the tungsten carbide coating from the surface between the connection pads. ### Claim 8 (depends on 1) Method according to claim 1, wherein the electronic circuit is an application-specific integrated circuit or a printed circuit board. ### Claim 9 Ultrasonic device comprising: an electroacoustic component; first connection pads bonded to the electroacoustic component; an electronic circuit; second connection pads bonded to the electronic circuit; and solder balls bonded to the first connection pads by first bonds resulting from two operations of melting of the solder balls and of the first connection pads, and bonded to the second connection pads by second bonds resulting from a single melting of the second connection pads. ### Claim 10 (depends on 9) Ultrasonic device according to claim 9, wherein each first connection pad comprises a stack of a bonding layer, of a metal layer, and of a finishing layer, the metal layer being interposed between the bonding layer and the finishing layer, the bonding layer being in direct physical contact with the electroacoustic component and the metal layer, and the finishing layer being in direct physical contact with the metal layer. ### Claim 11 (depends on 10) Ultrasonic device according to claim 10, wherein the bonding layer is made of chromium or of a chromium alloy. ### Claim 12 (depends on 10) Ultrasonic device according to claim 10, wherein the metal layer is made of copper. ### Claim 13 (depends on 10) Ultrasonic device according to claim 10, wherein the finishing layer is made of gold. ### Claim 14 (depends on 9) Ultrasonic device according to claim 9, wherein the electroacoustic component comprises a tungsten carbide coating, the first connection pads being in direct physical contact with the coating. ### Claim 15 (depends on 9) Ultrasonic device according to claim 9, wherein the electronic circuit is an application-specific integrated circuit or a printed circuit board.