# US 2026/0076245 A1 · Metal bump containing structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0076245 A1 - Document ID: US20260076245A1 - Status: Published application - Kind: A1 - Application number: 18/828,525 - Filed: 2024-09-09 - Published: 2026-03-12 - Earliest claimed: 2024-09-09 - Assignees: International Business Machines Corporation - Applicants: International Business Machines Corporation - Inventors: Toyohiro Aoki; Takahito Watanabe; KOKI NAKAMURA - Web page: https://patentgrep.com/patent/US20260076245A1 ## CPC - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/012: {of bump connectors, dummy bumps or thermal bumps} - H10W 72/01235: {by plating, e.g. electroless plating or electroplating} - H10W 72/07254: {changes in dispositions} - H10W 72/221: {Structures or relative sizes} - H10W 72/223: {characterised by the structure of the outermost layers, e.g. multilayered coatings} - H10W 72/234: {Cross-sectional shape, i.e. in side view} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/255: {of outermost layers of multilayered bumps, e.g. material of a coating} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A metal bump containing structure is provided which has a substantially flat top surface and enhanced coplanarity with other like metal bump containing structures. The metal bump containing structures include a metal bump having a curved top surface, and a first metal liner located along an outermost sidewall and present at least partially on the curved top surface of the metal bump. ## Claims ### Claim 1 A structure comprising: a metal bump containing structure having a substantially flat top surface and located on top of a substrate, the metal bump containing structure comprises a metal bump having a curved top surface, and a first metal liner located along an outermost sidewall and present at least partially on the curved top surface of the metal bump. ### Claim 2 (depends on 1) The structure of claim 1, wherein the metal bump is disposed on a metal seed layer, and the metal seed layer is composed of a first metal and the metal bump is composed of a second metal. ### Claim 3 (depends on 2) The structure of claim 2, wherein the first metal is compositionally a same metal as the second metal. ### Claim 4 (depends on 2) The structure of claim 2, wherein the first metal is compositionally different from the second metal. ### Claim 5 (depends on 2) The structure of claim 2, wherein the metal seed layer has a width that is larger than a width of the metal bump. ### Claim 6 (depends on 2) The structure of claim 2, wherein the metal seed layer has a same width as the metal bump. ### Claim 7 (depends on 1) The structure of claim 1, further comprising an adhesion layer located between the metal bump containing structure and the substrate. ### Claim 8 (depends on 1) The structure of claim 1, wherein the metal bump is composed of a second metal and the first metal liner is composed of a third metal, and the second metal is compositionally the same as the third metal. ### Claim 9 (depends on 1) The structure of claim 1, wherein the metal bump is composed of a second metal and the first metal liner is composed of a third metal, and the second metal is compositionally different than the third metal. ### Claim 10 (depends on 1) The structure of claim 1, further comprising a second metal liner located on the first metal liner. ### Claim 11 (depends on 1) The structure of claim 1, wherein the first metal liner is present entirely along the curved top surface of the metal bump. ### Claim 12 (depends on 1) The structure of claim 1, wherein the first metal liner is present partially along the curved top surface of the metal bump. ### Claim 13 (depends on 1) The structure of claim 1, further comprising at least one other metal bump containing structure having a substantially flat top surface and located on top of the substrate, the at least one other metal bump containing structure comprises another metal bump having a curved top surface, and another first metal liner located along an outermost sidewall and present at least partially on the curved top surface of the least one other metal bump containing structure, wherein the at least one other metal bump containing structure is spaced apart from the metal bump containing structure, and the substantially flat top surface of the at least one other metal bump containing structure is coplanar with the substantially flat top surface of the metal bump containing structure. ### Claim 14 (depends on 1) The structure of claim 1, wherein the metal bump containing structure is joined to solder, or to another metal bump containing structure. ### Claim 15 A method comprising: forming a metal seed layer on a substrate; plating a metal bump on the metal seed layer, the metal bump having a curved top surface; and plating a first metal liner on an outermost sidewall and at least partially on the curved top surface of the metal bump, wherein the plating of the first metal liner is performed in a plating solution and in the presence of a plate fixture that is in contact with, or close proximity to, the metal bump. ### Claim 16 (depends on 15) The method of claim 15, wherein the plate fixture is a solid piece having a flat contact surface. ### Claim 17 (depends on 15) The method of claim 15, wherein the plate fixture comprises a base sheet having a plurality of holes that extend entirely through the base sheet. ### Claim 18 (depends on 15) The method of claim 15, wherein the plate fixture comprises a base and finger-like protrusions extending from the base, wherein a cavity is located between each neighboring pair of finger-like protrusions. ### Claim 19 (depends on 15) The method of claim 15, wherein the plate fixture comprises a base sheet having silts that extending entirely through the base sheet, wherein a first set of the silts are configured as plating solution inlets and a second set of the silts are configured as plating solution outlets. ### Claim 20 (depends on 15) The method of claim 15, wherein the plating of the metal bumps composes electroplating or electroless plating.