# US 2026/0076237 A1 · Semiconductor interposers with layer stackup features

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- Number: US 2026/0076237 A1
- Document ID: US20260076237A1
- Status: Published application
- Kind: A1
- Application number: 19/319,530
- Filed: 2025-09-04
- Published: 2026-03-12
- Earliest claimed: 2024-09-09
- Assignees: Raytheon Company
- Applicants: Raytheon Company
- Inventors: Jason G. Milne; Aaron George; Eric R. Miller; Amada M. Castro
- Web page: https://patentgrep.com/patent/US20260076237A1

## CPC

- H10W 70/635: {Through-vias}
- H10W 70/685: comprising multiple insulating layers
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 44/401: {Resistive arrangements (H10W44/20, H10W42/80 take precedence)}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 44/209: {Vertical interconnections, e.g. vias}
- H10W 44/212: {Coaxial feed-throughs in substrates}
- H10W 44/216: {Waveguides, e.g. strip lines}
- H10W 90/10: Configurations of laterally-adjacent chips
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/7295: {on the rear surface of insulating package substrates, interposers or RDLs, for connection outside of the package, e.g. ball grid array [BGA] bumps}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An apparatus includes an interposer configured to be electrically coupled to one or more semiconductor devices. The interposer includes a core having a substrate and first vias through the substrate, a first stackup of layers over a first side of the core, and a second stackup of layers over a second side of the core. The first stackup of layers includes first redistribution layers and first dielectric layers. The first redistribution layers are electrically coupled together using second vias through the first dielectric layers, and the first stackup of layers forms a first and a second stripline. The second stackup of layers includes second redistribution layers and second dielectric layers. The second redistribution layers are electrically coupled together using third vias through the second dielectric layers, and the second stackup of layers forms a third stripline.

## Claims

### Claim 1

An apparatus comprising:
an interposer configured to be electrically coupled to one or more semiconductor devices, the interposer comprising:
a core comprising a substrate and first vias through the substrate;
a first stackup of layers over a first side of the core, the first stackup of layers comprising first redistribution layers and first dielectric layers, the first redistribution layers electrically coupled together using second vias through the first dielectric layers, the first stackup of layers forming a first stripline and a second stripline; and
a second stackup of layers over a second side of the core opposite the first side, the second stackup of layers comprising second redistribution layers and second dielectric layers, the second redistribution layers electrically coupled together using third vias through the second dielectric layers, the second stackup of layers forming a third stripline.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein:
at least some of the first, second, and third vias are stacked to form direct electrical pathways straight through the interposer;
the first dielectric layers are thicker than the first redistribution layers;
the second dielectric layers are thicker than the second redistribution layers; and
each of the first dielectric layers and the second dielectric layers comprises a material having a dielectric constant between about 1 and about 12.

### Claim 3 (depends on 1)

The apparatus of claim 1, wherein:
the first stackup of layers comprises at least five first redistribution layers separated by at least four first dielectric layers; and
the second stackup of layers comprises at least three second redistribution layers separated by at least two second dielectric layers.

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein:
the first redistribution layers alternate between having a thickness of about twice a base value and about the base value;
each of the first dielectric layers has a thickness of about three times the base value;
the second redistribution layers alternate between having a thickness of about twice the base value and about the base value; and
each of the second dielectric layers has a thickness of about three times the base value.

### Claim 5 (depends on 4)

The apparatus of claim 4, wherein the base value is between about 0.5 microns and about 2 microns.

### Claim 6 (depends on 5)

The apparatus of claim 5, wherein:
the base value is about 1 micron;
each of the second vias and the third vias comprises a diameter of about 3 microns; and
each of a plurality of conductive portions of the first redistribution layers contacting the second vias and each of a plurality of conductive portions of the second redistribution layers contacting the third vias comprises a diameter of about 4 microns.

### Claim 7 (depends on 1)

The apparatus of claim 1, wherein each stackup of layers further comprises at least one of: one or more embedded resistors, each having a sheet resistance value between about 1 and about 1,000 Ohms/square, or one or more embedded capacitors, each comprising a dielectric material having a dielectric constant between about 1 and about 100.

### Claim 8 (depends on 1)

The apparatus of claim 1, wherein the interposer further comprises:
first electrical connectors over and electrically coupled to the first stackup of layers; and
second electrical connectors over and electrically coupled to the second stackup of layers.

### Claim 9 (depends on 1)

The apparatus of claim 1, wherein:
the first stripline forms a first transmission or impedance line;
the second stripline forms a second transmission or impedance line;
the third stripline forms a third transmission or impedance line; and
each of the first, second, and third transmission or impedance lines has a specified impedance.

### Claim 10 (depends on 9)

The apparatus of claim 9, wherein:
each of the first stripline and the second stripline forms a single-ended transmission line; or
the first stripline and the second stripline together form a differential transmission line.

### Claim 11 (depends on 1)

The apparatus of claim 1, wherein each stackup of layers comprises a high-density stackup of layers configured to implement a digital communication protocol between at least one of: two or more semiconductor devices or portions of a single semiconductor device.

### Claim 12 (depends on 1)

The apparatus of claim 1, wherein:
the first redistribution layers have a ground-signal-ground-signal-ground pattern such that the first stripline and the second stripline share a common ground; and
the second redistribution layers have a ground-signal-ground pattern.

### Claim 13

A system comprising:
one or more semiconductor devices; and
a package enclosing the one or more semiconductor devices, the package comprising an interposer electrically coupled to the one or more semiconductor devices, the interposer comprising:
a core comprising a substrate and first vias through the substrate;
a first stackup of layers over a first side of the core, the first stackup of layers comprising first redistribution layers and first dielectric layers, the first redistribution layers electrically coupled together using second vias through the first dielectric layers, the first stackup of layers forming a first stripline and a second stripline; and
a second stackup of layers over a second side of the core opposite the first side, the second stackup of layers comprising second redistribution layers and second dielectric layers, the second redistribution layers electrically coupled together using third vias through the second dielectric layers, the second stackup of layers forming a third stripline.

### Claim 14 (depends on 13)

The system of claim 13, wherein:
the first redistribution layers alternate between having a thickness of about twice a base value and about the base value;
each of the first dielectric layers has a thickness of about three times the base value;
the second redistribution layers alternate between having a thickness of about twice the base value and about the base value;
each of the second dielectric layers has a thickness of about three times the base value; and
the base value is between about 0.5 microns and about 2 microns.

### Claim 15 (depends on 14)

The system of claim 14, wherein:
the base value is about 1 micron;
each of the second vias and the third vias comprises a diameter of about 3 microns; and
each of a plurality of conductive portions of the first redistribution layers contacting the second vias and each of a plurality of conductive portions of the second redistribution layers contacting the third vias comprises a diameter of about 4 microns.

### Claim 16 (depends on 13)

The system of claim 13, wherein each stackup of layers further comprises at least one of: one or more embedded resistors, each having a sheet resistance value between about 1 and about 1,000 Ohms/square, or one or more embedded capacitors, each comprising a dielectric material having a dielectric constant between about 1 and about 100.

### Claim 17 (depends on 13)

The system of claim 13, wherein the package further comprises:
a package substrate;
a stiffener mounted on the package substrate and positioned at least partially around the interposer; and
a lid attached to the stiffener to define an interior space between the lid, the stiffener, and the package substrate, the one or more semiconductor devices and the interposer positioned within the interior space.

### Claim 18 (depends on 17)

The system of claim 17, further comprising:
a printed circuit board on which the package is mounted;
wherein the interposer is configured to facilitate communication between the one or more semiconductor devices and the printed circuit board.

### Claim 19 (depends on 13)

The system of claim 13, wherein each stackup of layers comprises a high-density stackup of layers configured to implement a digital communication protocol between at least one of: two or more semiconductor devices or two or more connectors of a single semiconductor device.

### Claim 20

A method comprising:
obtaining a core comprising a substrate and first vias through the substrate;
forming a first stackup of layers over a first side of the core, the first stackup of layers comprising first redistribution layers and first dielectric layers, the first redistribution layers electrically coupled together using second vias through the first dielectric layers, the first stackup of layers forming a first stripline and a second stripline; and
forming a second stackup of layers over a second side of the core opposite the first side, the second stackup of layers comprising second redistribution layers and second dielectric layers, the second redistribution layers electrically coupled together using third vias through the second dielectric layers, the second stackup of layers forming a third stripline.