# US 2026/0076210 A1 · Semiconductor package with redistribution structure and manufacturing method thereof

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- Number: US 2026/0076210 A1
- Document ID: US20260076210A1
- Status: Published application
- Kind: A1
- Application number: 19/393,431
- Filed: 2025-11-18
- Published: 2026-03-12
- Earliest claimed: 2019-09-26
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Wei-Cheng Wu; Chien-Chia Chiu; Cheng-Hsien Hsieh; Li-Han Hsu; Meng-Tsan Lee; Tsung-Shu Lin
- Web page: https://patentgrep.com/patent/US20260076210A1

## CPC

- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10P 72/74: {using temporarily an auxiliary support}
- H10W 20/056: {by filling conductive material into holes, grooves or trenches}
- H10W 20/081: {by forming openings in the dielectric parts}
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 70/635: {Through-vias}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 74/01: Manufacture or treatment
- H10W 74/10: characterised by their shape or disposition
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10P 72/7424: {used as a support during the manufacture of self-supporting substrates}
- H10P 72/743: {used as a support during manufacture of interconnect decals or build up layers}
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/63: Vias, e.g. via plugs
- H10W 72/0198: {batch processes}
- H10W 72/073: {of die-attach connectors}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/874: {On different surfaces}
- H10W 72/9413: {on encapsulations}
- H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body}
- H10W 90/10: Configurations of laterally-adjacent chips
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.

## Claims

### Claim 1

A package, comprising:
a molding structure including a die laterally wrapped by an insulating encapsulant; and
a redistribution structure disposed on the molding structure, wherein the redistribution structure comprises a dielectric layer, and first metallic patterns and second metallic patterns disposed in the dielectric layer, the first metallic patterns are in physical contact with the die, and the second metallic patterns are in physical contact with the insulating encapsulant.

### Claim 2 (depends on 1)

The package of claim 1, wherein the first metallic patterns include routing patterns electrically connected with the die, and the second metallic patterns include shielding plates electrically insulated from the die.

### Claim 3 (depends on 2)

The package of claim 2, further comprising dummy connectors and active connectors disposed over the redistribution structure, the active connectors are connected with the routing patterns, and the dummy connectors are connected with the shielding plates.

### Claim 4 (depends on 1)

The package of claim 1, wherein the first metallic patterns include routing patterns electrically connected with the die, and the second metallic patterns include anchor patterns.

### Claim 5 (depends on 1)

The package of claim 1, wherein the first metallic patterns include routing patterns electrically connected with the die, and the second metallic patterns include anchor patterns and shielding plates electrically insulated from the die.

### Claim 6 (depends on 5)

The package of claim 5, further comprising dummy connectors and active connectors disposed over the redistribution structure, the active connectors are connected with the routing patterns, and the dummy connectors are connected with the shielding plates.

### Claim 7 (depends on 6)

The package of claim 6, further comprising a circuit substrate having dummy pads connected with the dummy connectors and active pads connected with the active connectors, wherein the die is electrically connected with the circuit substrate through the active connectors connected to the active pads.

### Claim 8

A package, comprising:
a molding structure including a die, conductive pillars aside the die and an insulating encapsulant laterally wrapping the die and the conductive pillars; and
a redistribution structure disposed on a first side of the molding structure, wherein the redistribution structure comprises a dielectric layer, and first metallic patterns, second metallic patterns and third metallic patterns in the dielectric layer,
wherein the first metallic patterns are electrically connected with conductive contacts of the die, the second metallic patterns are in contact with the conductive pillars, and the third metallic patterns are in contact with the insulating encapsulant.

### Claim 9 (depends on 8)

The package of claim 8, further comprising a redistribution layer disposed on a second side of the molding structure opposite to the first side, and the redistribution structure and the redistribution layer are electrically connected by the conductive pillars.

### Claim 10 (depends on 9)

The package of claim 9, wherein the first metallic patterns include first routing patterns electrically connected with the die, and the third metallic patterns include anchor patterns.

### Claim 11 (depends on 10)

The package of claim 10, wherein the second metallic patterns include second routing patterns electrically connected with the die, and shielding plates electrically insulated from the die.

### Claim 12 (depends on 11)

The package of claim 11, further comprising dummy connectors and active connectors disposed over the redistribution structure, the active connectors are connected with the first and second routing patterns, and the dummy connectors are connected with the shielding plates.

### Claim 13 (depends on 12)

The package of claim 12, wherein portions of the first routing patterns are physically connected with the anchor patterns and with the active connectors.

### Claim 14

A package, comprising:
a first molding structure having a first region and a second region around the first region, wherein the first molding structure includes a first die and first pillars aside the first die in the first region, second pillars aside the first pillars and located in the second region, and a first insulating encapsulant laterally wrapping the first die and the first and second pillars;
a first redistribution structure, disposed on a first side of the first molding structure; and
a second redistribution structure, disposed on a second side of the first molding structure opposite to the first side, wherein the first and second redistribution structures are electrically connected by the first pillars, and the second redistribution structure comprises a dielectric layer, and first metallic patterns, second metallic patterns and third metallic patterns in the dielectric layer,
wherein the first metallic patterns are electrically connected with the first die, the second metallic patterns are in contact with the first and second pillars, and the third metallic patterns are in contact with the first insulating encapsulant.

### Claim 15 (depends on 14)

The package of claim 14, further comprising a second molding structure disposed on the first redistribution structure, wherein the second molding structure includes a second die electrically connected with the first die and a second insulating encapsulant laterally wrapping the second die.

### Claim 16 (depends on 15)

The package of claim 15, wherein the second metallic patterns include first routing patterns connected with the first pillars and electrically connected with the first die and the second die, and shielding plates connected with the second pillars and electrically insulated from the first and second die.

### Claim 17 (depends on 16)

The package of claim 16, wherein the first metallic patterns include second routing patterns connected with the first routing patterns and electrically connected with the first die and the second die, and the third metallic patterns include anchor patterns.

### Claim 18 (depends on 16)

The package of claim 16, further comprising dummy connectors and active connectors disposed over the second redistribution structure, the active connectors are connected with the first and second routing patterns and the first pillars, and the dummy connectors are connected with the shielding plates and the second pillars.

### Claim 19 (depends on 17)

The package of claim 17, wherein portions of the second routing patterns are physically connected with the anchor patterns and with the active connectors.

### Claim 20 (depends on 15)

The package of claim 15, wherein the second molding structure further includes a third die disposed beside the second die, and the first die includes a bridge die electrically connecting the second and third dies.