# US 2026/0076208 A1 · Manufacturing method of electromagnetic shielding structure and packaging structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0076208 A1 - Document ID: US20260076208A1 - Status: Published application - Kind: A1 - Application number: 19/184,490 - Filed: 2025-04-21 - Published: 2026-03-12 - Earliest claimed: 2024-09-09 - Assignees: Forehope Electronic (Ningbo) Co., Ltd. - Applicants: Forehope Electronic (Ningbo) Co., Ltd. - Inventors: Lei ZHONG; Yupeng XU; Li Li; Zhenghong HE - Web page: https://patentgrep.com/patent/US20260076208A1 ## CPC - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 74/016: {using moulds} - H10W 72/0198: {batch processes} - H10W 74/10: characterised by their shape or disposition - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Provided are manufacturing method of electromagnetic shielding structure and packaging structure. Manufacturing method includes providing substrate having first element; and forming shielding portion on substrate by using 3D printing technology, wherein shielding portion is arranged at periphery of first element; and the step includes: constructing three-dimensional model of shielding portion; identifying target position on substrate; and laying printing material at target position based on three-dimensional model to pre-form shielding portion; injecting molding compound onto substrate to form encapsulation that encapsulates first element and shielding portion, wherein molding compound undergoes crosslinking reaction with printing material; grinding encapsulation so that shielding portion is exposed from surface of encapsulation; and forming metal layer on surface of encapsulation, wherein metal layer is electrically connected to shielding portion, and at least one of metal layer and shielding portion has grounding properties. ## Claims ### Claim 1 A manufacturing method of an electromagnetic shielding structure, comprising: providing a substrate having a first element; forming a shielding portion on the substrate by using 3D printing technology, wherein the shielding portion is arranged at a periphery of the first element; and the step comprises: constructing a three-dimensional model of the shielding portion; identifying a target position on the substrate; and laying a printing material at the target position in accordance with the three-dimensional model to pre-form the shielding portion; injecting a molding compound onto the substrate to form an encapsulation that encapsulates the first element and the shielding portion, wherein the molding compound undergoes a crosslinking reaction with the printing material; grinding the encapsulation so that the shielding portion is exposed from a surface of the encapsulation; and forming a metal layer on the surface of the encapsulation, wherein the metal layer is electrically connected to the shielding portion, and at least one of the metal layer and the shielding portion has grounding properties. ### Claim 2 (depends on 1) The manufacturing method of an electromagnetic shielding structure according to claim 1, wherein in the step of laying printing material at the target position in accordance with the three-dimensional model to pre-form the shielding portion, a pre-forming temperature is 100°C. to 200°C.; and in the step of injecting a molding compound onto the substrate to form an encapsulation that encapsulates the first element and the shielding portion, a curing temperature of the molding compound is 250°C. to 350°C. ### Claim 3 (depends on 1) The manufacturing method of an electromagnetic shielding structure according to claim 1, wherein the printing material is nano-metal conductive paste. ### Claim 4 (depends on 1) The manufacturing method of an electromagnetic shielding structure according to claim 1, wherein a solder mask is arranged on the surface of the substrate; and in the step of forming a shielding portion on the substrate by using 3D printing technology, the shielding portion is directly formed on the solder mask. ### Claim 5 (depends on 1) The manufacturing method of an electromagnetic shielding structure according to claim 1, wherein a solder mask is arranged on the surface of the substrate; the substrate is provided with a solder pad exposed from a surface of the solder mask; and in the step of forming a shielding portion on the substrate by using 3D printing technology, the shielding portion is directly formed on the solder pad. ### Claim 6 (depends on 1) The manufacturing method of an electromagnetic shielding structure according to claim 1, wherein the shielding portion is provided with a first end and a second end that are oppositely arranged, the first end is connected to the substrate, a sectional area of the second end is smaller than a sectional area of the first end, and the second end has a tip. ### Claim 7 (depends on 6) The manufacturing method of an electromagnetic shielding structure according to claim 6, wherein the second end is continuously bent in a Z shape, wavy shape, or stepped shape. ### Claim 8 (depends on 6) The manufacturing method of an electromagnetic shielding structure according to claim 6, wherein a section of the second end is arc-shaped, sector-shaped, or polygonal, and the section of the second end gradually decreases in a direction away from the substrate. ### Claim 9 (depends on 6) The manufacturing method of an electromagnetic shielding structure according to claim 6, wherein the second end is provided with a through hole and/or a groove. ### Claim 10 (depends on 9) The manufacturing method of an electromagnetic shielding structure according to claim 9, wherein the step of forming a shielding portion on the substrate by using 3D printing technology comprises: forming a main body portion having the first end on the substrate by using the 3D printing technology; and forming the second end at an end of the main body portion away from the first end by using the 3D printing technology, wherein the through hole and/or the groove is integrally formed in the step of forming the second end by using 3D printing. ### Claim 11 (depends on 6) The manufacturing method of an electromagnetic shielding structure according to claim 6, wherein the shielding portion comprises multiple shielding pillars arranged at intervals; and/or, the shielding portion comprises a shielding wall having a continuous surface. ### Claim 12 (depends on 1) The manufacturing method of an electromagnetic shielding structure according to claim 1, wherein a projection shape of the shielding portion on the substrate is a closed shape or has at least one opening. ### Claim 13 (depends on 1) The manufacturing method of an electromagnetic shielding structure according to claim 1, wherein a second element is further arranged on the substrate, and the shielding portion isolates the first element from the second element. ### Claim 14 (depends on 13) The manufacturing method of an electromagnetic shielding structure according to claim 13, wherein the shielding portion is arranged at the periphery of the first element, and a shielding wire formed by wire bonding is arranged at a periphery of the second element. ### Claim 15 (depends on 1) A packaging structure, prepared using the manufacturing method of an electromagnetic shielding structure according to claim 1. ### Claim 16 (depends on 15) The packaging structure according to claim 15, wherein the shielding structure is arranged at the periphery of the first element, and the shielding structure entirely uses the shielding portion formed by 3D printing; or, the shielding structure comprises the shielding portion formed by 3D printing and a shielding wire formed by wire bonding, wherein the shielding portion formed by 3D printing and the shielding wire formed by wire bonding are alternately arranged or arranged side by side.