# US 2026/0076201 A1 · Lid or stiffener attachment structure with a hybrid adhesive

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- Number: US 2026/0076201 A1
- Document ID: US20260076201A1
- Status: Published application
- Kind: A1
- Application number: 18/830,397
- Filed: 2024-09-10
- Published: 2026-03-12
- Earliest claimed: 2024-09-10
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Nrup Liljibhai BALAR; Zheng REN; Shaoyin GUO
- Web page: https://patentgrep.com/patent/US20260076201A1

## CPC

- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J 183/04: Polysiloxanes
- H10W 76/60: Seals
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)

## Abstract

An embodiment may include an apparatus, that comprises a first substrate and an adhesive layer on the first substrate. In an embodiment, the adhesive layer comprises a first adhesive, where the first adhesive is a polymer that comprises silicon and oxygen, and a second adhesive, where the second adhesive is an epoxy. In an embodiment, the first adhesive is adjacent to the second adhesive. In an embodiment, the apparatus further comprises a second substrate coupled to the first substrate by the adhesive layer.

## Claims

### Claim 1

An apparatus, comprising:
a first substrate;
an adhesive layer on the first substrate, wherein the adhesive layer comprises:
a first adhesive, wherein the first adhesive is a polymer that comprises silicon and oxygen; and
a second adhesive, wherein the second adhesive is an epoxy, and wherein the first adhesive is adjacent to the second adhesive; and
a second substrate coupled to the first substrate by the adhesive layer.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein a sidewall of the first adhesive is covered by the second adhesive.

### Claim 3 (depends on 1)

The apparatus of claim 1, wherein a perimeter of the first adhesive is surrounded by the second adhesive.

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein a height of the first adhesive is substantially equal to a height of the second adhesive.

### Claim 5 (depends on 1)

The apparatus of claim 1, wherein a portion of the second adhesive is provided between the first adhesive and the second substrate.

### Claim 6 (depends on 1)

The apparatus of claim 1, wherein a sidewall of the first adhesive is curved.

### Claim 7 (depends on 1)

The apparatus of claim 1, wherein the first adhesive comprises a plurality of pillars, and wherein each of the plurality of pillars are surrounded by the second adhesive.

### Claim 8 (depends on 1)

The apparatus of claim 1, wherein the first substrate is a package substrate, and wherein the second substrate is a stiffener, an integrated heat spreader (IHS), or a lid.

### Claim 9 (depends on 8)

The apparatus of claim 8, wherein the second substrate is a ring, and wherein a die is coupled to the package substrate within an opening of the ring.

### Claim 10 (depends on 9)

The apparatus of claim 9, wherein the package substrate is coupled to a board.

### Claim 11

An apparatus, comprising:
a package substrate;
a die coupled to the package substrate; and
a frame coupled to the package substrate by a hybrid adhesive layer, wherein the hybrid adhesive layer comprises:
a plurality of pillars, wherein the plurality of pillars comprise a first material composition; and
a matrix that surrounds the plurality of pillars, wherein the matrix comprises a second material composition that is different than the first material composition.

### Claim 12 (depends on 11)

The apparatus of claim 11, wherein the first material composition comprises silicon and oxygen.

### Claim 13 (depends on 11)

The apparatus of claim 11, wherein the second material composition comprises an epoxy.

### Claim 14 (depends on 11)

The apparatus of claim 11, wherein the plurality of pillars are distributed around a perimeter of the die.

### Claim 15 (depends on 11)

The apparatus of claim 11, wherein the plurality of pillars are positioned proximate to corners of the frame.

### Claim 16 (depends on 11)

The apparatus of claim 11, wherein the plurality of pillars contact the package substrate and the frame.

### Claim 17 (depends on 11)

The apparatus of claim 11, wherein a portion of the matrix is between one or more of the plurality of pillars and the frame.

### Claim 18

An apparatus, comprising:
a package substrate;
a layer coupled to the package substrate by an adhesive, and wherein the adhesive comprises:
an epoxy matrix; and
a plurality of silicone structures embedded in the epoxy matrix.

### Claim 19 (depends on 18)

The apparatus of claim 18, wherein the plurality of silicone structures have curved sidewalls.

### Claim 20 (depends on 18)

The apparatus of claim 18, wherein the layer is a stiffener comprising a metallic material.