# US 2026/0076196 A1 · Package with Heat Dissipation Structure and Method for Forming the Same

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- Number: US 2026/0076196 A1
- Document ID: US20260076196A1
- Status: Published application
- Kind: A1
- Application number: 19/392,281
- Filed: 2025-11-18
- Published: 2026-03-12
- Earliest claimed: 2022-10-26
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Co., Ltd.
- Inventors: Tung-Liang Shao; You-Rong Shaw; Yu-Sheng Huang; Chen-Hua Yu
- Web page: https://patentgrep.com/patent/US20260076196A1

## CPC

- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10P 72/74: {using temporarily an auxiliary support}
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 70/027: {Mechanical treatments, e.g. deforming, punching or cutting}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/30: Die-attach connectors
- H10W 72/851: {Dispositions of multiple connectors or interconnections}
- H10W 74/016: {using moulds}
- H10W 74/124: {the encapsulations having cavities other than that occupied by chips}
- H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70)
- H10W 90/00: Package configurations
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10P 72/7424: {used as a support during the manufacture of self-supporting substrates}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/635: {Through-vias}
- H10W 72/073: {of die-attach connectors}
- H10W 72/351: {Materials of die-attach connectors}
- H10W 74/01: Manufacture or treatment
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 76/15: Containers comprising an insulating or insulated base
- H10W 76/63: characterised by their shape or disposition, e.g. between cap and walls of a container
- H10W 90/288: {characterised by arrangements for thermal management of the stacked chips}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

In an embodiment, a package includes an encapsulant laterally surrounding a first integrated circuit device and a second integrated circuit device, wherein the first integrated circuit device includes a die and a heat dissipation structure over the die; a sealant disposed over the heat dissipation structure; an adhesive disposed over the second integrated circuit device; and a lid disposed over the sealant and the adhesive, wherein the lid includes a first cooling passage and a second cooling passage, the first cooling passage including an opening at a bottom of the lid and aligned to the heat dissipation structure, the second cooling passage including channels aligned to the second integrated circuit device and being distant from the bottom of the lid.

## Claims

### Claim 1

A method for forming a package, the method comprising:
forming an encapsulant laterally surrounding a first integrated circuit device and a second integrated circuit device, wherein the first integrated circuit device comprises a die and a heat dissipation structure over the die, wherein the heat dissipation structure comprises channels on a first side of the heat dissipation structure;
disposing a sealant over the heat dissipation structure;
disposing an adhesive over the second integrated circuit device; and
disposing a lid over the sealant and the adhesive, wherein the lid comprises a first cooling passage and a second cooling passage, the first cooling passage comprising an opening at a bottom of the lid and aligned to the channels in the heat dissipation structure, the second cooling passage comprising horizontal channels aligned to the second integrated circuit device and being distant from the bottom of the lid.

### Claim 2 (depends on 1)

The method of claim 1, wherein disposing the lid over the sealant and the adhesive forms a cavity enclosed by the lid, the sealant, and the heat dissipation structure.

### Claim 3 (depends on 2)

The method of claim 2, further comprising filling the channels with a sacrificial material before forming the encapsulant and removing the sacrificial material before disposing the lid.

### Claim 4 (depends on 1)

The method of claim 1, wherein the first cooling passage and the second cooling passage are formed by drilling a bulk material of the lid.

### Claim 5 (depends on 1)

The method of claim 1, wherein the lid is formed using molding or 3D print.

### Claim 6 (depends on 1)

The method of claim 1, further comprising:
attaching the first integrated circuit device and the second integrated circuit device to an interposer;
attaching the interposer to a substrate; and
attaching a ring structure to the interposer, wherein the ring structure laterally surrounds the interposer.

### Claim 7 (depends on 1)

The method of claim 1, further comprising bonding the heat dissipation structure to the die before forming the encapsulant.

### Claim 8 (depends on 1)

The method of claim 1, wherein disposing the lid comprises attaching a lower part of the lid to an upper part of the lid.

### Claim 9

A method comprising:
attaching a first integrated circuit device to an interposer, wherein the first integrated circuit device comprises a die and a heat dissipation structure over the die, wherein the heat dissipation structure includes a first substrate having trenches in a first side and a sacrificial material in the trenches, wherein the die is between the heat dissipation structure and the interposer;
forming an encapsulant over the interposer and along sidewalls of the first integrated circuit device;
removing the sacrificial material from the trenches in the first substrate of the heat dissipation structure to form channels; and
attaching a lid to the heat dissipation structure to form a cavity, wherein the cavity is enclosed by the lid and the heat dissipation structure.

### Claim 10 (depends on 9)

The method of claim 9, wherein the first substrate comprises silicon, and wherein the sacrificial material comprises a polymer material.

### Claim 11 (depends on 9)

The method of claim 9, wherein an upper surface of the encapsulant is level with an upper surface of the first substrate.

### Claim 12 (depends on 9)

The method of claim 9, wherein the lid comprises:
a first cooling passage having a first inlet opening and a first outlet opening, wherein the first cooling passage is aligned with the channels of the heat dissipation structure; and
a second cooling passage having a second inlet opening and a second outlet opening, the second cooling passage being disposed entirely within the lid.

### Claim 13 (depends on 12)

The method of claim 12, further comprising:
attaching a second integrated circuit device to the interposer, wherein the second cooling passage is positioned over the second integrated circuit device.

### Claim 14 (depends on 13)

The method of claim 13, wherein the second cooling passage is spaced apart from the second integrated circuit device.

### Claim 15 (depends on 9)

The method of claim 9, further comprising:
attaching the interposer to a substrate; and
attaching a ring structure to the interposer, wherein the ring structure laterally surrounds the encapsulant.

### Claim 16

A method comprising:
forming trenches in a heat dissipation substrate;
filling the trenches with a sacrificial material to form strips;
bonding the heat dissipation substrate to a first integrated circuit die;
after bonding the heat dissipation substrate to the first integrated circuit die, attaching the first integrated circuit die to an interposer;
forming an encapsulant over the interposer and along sidewalls of the first integrated circuit die;
removing the sacrificial material to form micro-channels in the heat dissipation substrate; and
attaching a lid structure over the heat dissipation substrate, wherein the lid structure includes channels, wherein the channels are aligned with the micro-channels of the heat dissipation substrate.

### Claim 17 (depends on 16)

The method of claim 16, wherein removing the sacrificial material is performed after forming the encapsulant.

### Claim 18 (depends on 16)

The method of claim 16, wherein the lid structure comprises:
a first cooling passage having a first inlet opening and a first outlet opening, wherein the first cooling passage connects with the micro-channels of the heat dissipation substrate; and
a second cooling passage having a second inlet opening and a second outlet opening, the second cooling passage being spaced apart from a bottom of the lid structure.

### Claim 19 (depends on 18)

The method of claim 18, further comprising:
attaching the lid structure to a second integrated circuit die, wherein the first cooling passage is positioned over the first integrated circuit die, wherein the second cooling passage is positioned over the second integrated circuit die.

### Claim 20 (depends on 19)

The method of claim 19, wherein the lid structure comprises a lower part, an upper part, and a seal ring between the lower part and the upper part, wherein the first cooling passage extends through the lower part, wherein the second cooling passage extends partially through the lower part.