# US 2026/0076181 A1 · Switch module and inverter > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0076181 A1 - Document ID: US20260076181A1 - Status: Published application - Kind: A1 - Application number: 19/391,194 - Filed: 2025-11-17 - Published: 2026-03-12 - Earliest claimed: 2021-03-03 - Assignees: Denso Corporation - Applicants: Denso Corporation - Inventors: Yasushi FURUKAWA - Web page: https://patentgrep.com/patent/US20260076181A1 ## CPC - H03K 17/127: {in composite switches} - H10W 40/00: Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) - H02M 7/48: using discharge tubes with control electrode or semiconductor devices with control electrode - H03K 17/0822: {in field-effect transistor switches} - H10W 70/442: {of multiple leadframes in a single chip} - H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00} - H10W 76/138: having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type - H10W 90/00: Package configurations - H10W 90/811: {Multiple chips on leadframes} - H03K 2017/0806: {against excessive temperature} - H03K 2217/0027: Measuring means of, e.g. currents through or voltages across the switch - H10W 74/111: {the semiconductor body being completely enclosed} - H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) ## Abstract An electric apparatus includes: a first stacked body in which a first semiconductor chip having a first switch is stacked on a first mounting portion; a second stacked body in which a second semiconductor chip having a second switch is stacked on a second mounting portion; a temperature sensor provided in the first stacked body to detect a temperature of the first switch; and a current sensor provided in the second stacked body to detect a current flowing through the second switch. The second stacked body has a heat dissipation property higher than that of the first stacked body. ## Claims ### Claim 1 A switch module comprising: a first stacked body in which a first semiconductor chip having a first switch is stacked on a first mounting portion; a second stacked body in which a second semiconductor chip having a second switch is stacked on a second mounting portion, an on-resistance of the second switch being lower than an on-resistance of the first switch; a current sensor provided in the second stacked body to detect a current flowing through the second switch; a signal terminal connected to the first switch and the second switch; and a coating resin that coats the first stacked body, the second stacked body, and the signal terminal, to expose a portion of the signal terminal, wherein the signal terminal includes a current sensor terminal to which the current sensor is connected, and includes no terminal to detect a current flowing through the first switch. ### Claim 2 (depends on 1) The switch module according to claim 1, wherein a heat dissipation of the second stacked body is higher than a heat dissipation of the first stacked body. ### Claim 3 A switch module comprising: a first stacked body in which a first semiconductor chip having a first switch is stacked on a first mounting portion; a second stacked body in which a second semiconductor chip having a second switch is stacked on a second mounting portion, an on-resistance of the second switch being lower than an on-resistance of the first switch; a temperature sensor provided in the first stacked body to detect a temperature of the first switch; a current sensor provided in the second stacked body to detect a current flowing through the second switch; a signal terminal connected to the first switch and the second switch; and a coating resin that coats the first stacked body, the second stacked body, and the signal terminal, to expose a portion of the signal terminal, wherein the signal terminal includes a terminal to which the temperature sensor is connected, and a current sensor terminal to which the current sensor is connected, and the signal terminal includes no terminal to detect a temperature of the second switch and no terminal to detect a current flowing through the first switch. ### Claim 4 (depends on 1) The switch module according to claim 1, wherein the first switch and the second switch are connected in parallel. ### Claim 5 (depends on 1) The switch module according to claim 1, wherein a material of the first mounting portion is the same as a material of the second mounting portion, and a volume of the first mounting portion is smaller than a volume of the second mounting portion. ### Claim 6 (depends on 5) The switch module according to claim 5, wherein each of the first mounting portion and the second mounting portion has an exposed surface exposed from the coating resin, a first direction being defined along the exposed surface, a second direction being defined along the exposed surface and orthogonal to the first direction, the first stacked body and the second stacked body are arranged in the first direction, an overlapping region is defined in which a projection region of the first mounting portion projected in the second direction overlaps with a projection region of the second mounting portion projected in the first direction, and a part of the signal terminal is located in the overlapping region. ### Claim 7 (depends on 6) The switch module according to claim 6, wherein the signal terminal includes a common terminal electrically connected to each of the first switch and the second switch. ### Claim 8 (depends on 1) The switch module according to claim 1, wherein at least a part of the second mounting portion includes a different material different from a material of the first mounting portion, and a thermal conductivity of the second mounting portion is higher than a thermal conductivity of the first mounting portion. ### Claim 9 (depends on 1) The switch module according to claim 1, further comprising: a first joining member provided between the first semiconductor chip and the first mounting portion to join the first semiconductor chip and the first mounting portion; and a second joining member provided between the second semiconductor chip and the second mounting portion to join the second semiconductor chip and the second mounting portion, wherein at least a part of the second joining member includes a different material having a thermal conductivity higher than that of the first joining member. ### Claim 10 (depends on 1) The switch module according to claim 1, wherein an area of the first mounting portion is different from an area of the second mounting portion. ### Claim 11 (depends on 1) The switch module according to claim 1, wherein the signal terminal includes a gate terminal as a common terminal, the gate terminal is connected to a gate electrode of the first switch, and the gate terminal is connected to a gate electrode of the second switch. ### Claim 12 (depends on 1) The switch module according to claim 1, wherein the first switch and the second switch are configured to be simultaneously energized. ### Claim 13 (depends on 1) An inverter comprising: a high-side switch module and a low-side switch module connected in series between a first power supply bus bar and a second power supply bus bar, the high-side switch module includes a first switch module, a third switch module, and a fifth switch module, the low-side switch modules include a second switch module, a fourth switch module, and a sixth switch module, the first switch module and the second switch module are connected to a U-phase bus bar, the third switch module and the fourth switch module are connected to a V-phase bus bar, the fifth switch module and the sixth switch module are connected to a W-phase bus bar, and each of the first switch module, the second switch module, the third switch module, the fourth switch module, the fifth switch module, and the sixth switch module is the switch module according to claim 1.