# US 2026/0076014 A1 · Electronic device and reworking method for the electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0076014 A1 - Document ID: US20260076014A1 - Status: Published application - Kind: A1 - Application number: 18/968,192 - Filed: 2024-12-04 - Published: 2026-03-12 - Earliest claimed: 2024-09-06 - Assignees: AUO Corporation - Applicants: AUO Corporation - Inventors: YIN-TING LEE; Hui-Chuan CHEN; Bo-Yuan SU - Web page: https://patentgrep.com/patent/US20260076014A1 ## CPC - H10H 29/857: {Interconnections (of active-matrix LED displays H10H29/49)} - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/10128: Display - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic device includes a light emitting module having a light source module, a back frame configured to support the light source module, at least one stretch release adhesive tape, and a circuit substrate. The back frame has at least one through hole. The at least one stretch release adhesive tape is divided into a first section and a second section along an extending direction, and passes through the at least one through hole to be folded, such that the first section and the second section are respectively located on different sides of the at least one through hole and attached on different surfaces of the back frame facing different directions. At least a portion of the first section adheres and bonds the light source module and the back frame, and at least a portion of the second section adheres and bonds the back frame and the circuit substrate. ## Claims ### Claim 1 An electronic device, comprising: a light emitting module, having a light source module; a back frame, configured to support the light source module, and having at least one through hole; at least one stretch release adhesive tape, respectively divided into a first section and a second section along an extending direction, and passing through the at least one through hole to be folded, such that the first section and the second section are respectively located on different sides of the at least one through hole and attached on different surfaces of the back frame facing different directions, wherein at least a portion of the first section adheres and bonds the light source module and the back frame; and a circuit substrate, wherein at least a portion of the second section adheres and bonds the back frame and the circuit substrate. ### Claim 2 (depends on 1) The electronic device according to claim 1, wherein the light emitting module further comprises at least one first flexible circuit board electrically connected to the light source module, and the at least one first flexible circuit board passes through the at least one through hole from the light source module to be folded, such that the light source module and the at least one first flexible circuit board are respectively located on different sides of the at least one through hole and disposed on different surfaces of the back frame facing different directions, and wherein at least a portion of the second section adheres and bonds the back frame and the at least one first flexible circuit board. ### Claim 3 (depends on 2) The electronic device according to claim 2, wherein the at least one first flexible circuit board is clamped between the back frame and the circuit substrate, and the at least one first flexible circuit board is electrically connected to the light source module and the circuit substrate. ### Claim 4 (depends on 2) The electronic device according to claim 2, wherein a quantity of the at least one through hole is greater than a quantity of the at least one first flexible circuit board. ### Claim 5 (depends on 1) The electronic device according to claim 1, further comprising a functional module configured to facilitate a predetermined function, wherein the functional module comprises a panel module disposed on a surface of the light emitting module away from the back frame and at least one second flexible circuit board electrically connected to the panel module, wherein the back frame at least comprises a bottom plate, and the bottom plate has a front surface facing toward the panel module and a back surface away from the panel module, wherein the second section of the at least one stretch release adhesive tape adheres and bonds the back surface of the bottom plate and the circuit substrate, and wherein the at least one second flexible circuit board wraps outside a side edge of the bottom plate from the panel module and folds to the back surface, and is electrically connected to the circuit substrate. ### Claim 6 (depends on 5) The electronic device according to claim 5, wherein the functional module is a display module facilitating a display function, and the panel module is a display panel. ### Claim 7 (depends on 1) The electronic device according to claim 1, wherein a quantity of the at least one stretch release adhesive tape is greater than a quantity of the at least one through hole. ### Claim 8 (depends on 1) The electronic device according to claim 1, wherein the light source module is a direct type light emitting panel. ### Claim 9 (depends on 1) The electronic device according to claim 1, wherein the back frame at least has a bottom plate, the bottom plate has a first side edge and a second side edge opposite to each other, and the at least one through hole extends individually along a portion of the first side edge, and wherein the at least one stretch release adhesive tape extends along a first direction from the second side edge toward the first side edge on a front surface of the bottom plate away from the circuit substrate, and passes through the at least one through hole disposed along the first side edge to be folded to a back surface of the bottom plate on which the circuit substrate is disposed. ### Claim 10 (depends on 1) The electronic device according to claim 1, wherein the back frame at least has a bottom plate, the bottom plate has a first side edge and a second side edge opposite to each other, and a length direction of the circuit substrate extends along a portion of the first side edge, and wherein the at least one stretch release adhesive tape extends along a first direction from the second side edge toward the first side edge on a front surface of the bottom plate away from the circuit substrate, and passes through the at least one through hole to be folded to a back surface of the bottom plate on which the circuit substrate is disposed. ### Claim 11 (depends on 1) The electronic device according to claim 1, wherein a length of the first section is greater than a length of the second section. ### Claim 12 (depends on 1) The electronic device according to claim 1, wherein a protruding portion of the second section extending away from a tail end portion of the first section extends and protrudes out of the circuit substrate without adhering and bonding to the circuit substrate. ### Claim 13 (depends on 1) A reworking method for the electronic device according to claim 1, comprising: disassembling the circuit substrate from the back frame, and exposing a predetermined region of the second section of the at least one stretch release adhesive tape; and stretching the predetermined region to at least partially reduce an adhesiveness of the first section of the at least one stretch release adhesive tape connected to the predetermined region, thereby separating the light source module and the back frame. ### Claim 14 (depends on 13) The reworking method according to claim 13, wherein a protruding portion of the second section of the at least one stretch release adhesive tap extending away from a tail end portion of the first section extends and protrudes out of the circuit substrate, and wherein the disassembling the circuit substrate further comprises stretching the protruding portion to at least partially reduce an adhesiveness of the portion of the second section adhering and bonding the back frame and the circuit substrate, thereby separating the back frame and the circuit substrate. ### Claim 15 (depends on 13) The reworking method according to claim 13, wherein the light emitting module further comprises at least one first flexible circuit board electrically connected to the light source module and the circuit substrate, and the at least one first flexible circuit board passes through the at least one through hole from the light source module to be folded, such that the at least one first flexible circuit board and the light source module are disposed on different surfaces of the back frame facing different directions, and wherein the at least one first flexible circuit board partially adheres and bonds on the back frame by a portion of the second section of the at least one stretch release adhesive tap, and wherein the stretching the predetermined region further comprises stretching the predetermined region to at least partially reduce an adhesiveness of the second section, thereby separating the back frame and the at least one first flexible circuit board, and disassembling the light source module from the back frame based on the separating of the at least one first flexible circuit board. ### Claim 16 (depends on 13) The reworking method according to claim 13, wherein the electronic device further comprises a functional module configured to facilitate a predetermined function, wherein the functional module comprises a panel module disposed on a surface of the light emitting module away from the back frame and at least one second flexible circuit board electrically connected to the panel module, wherein the at least one second flexible circuit board is electrically connected to the panel module and the circuit substrate, and wherein the reworking method further comprises, between the disassembling the circuit substrate and stretching the predetermined region: with the circuit substrate being separated from the back frame, separating the at least one second flexible circuit board directly or indirectly connected to the circuit substrate from the back frame, and disassembling the panel module from the electronic device based on the separating of the at least one second flexible circuit board.