# US 2026/0076004 A1 · Led chip configuration method

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- Number: US 2026/0076004 A1
- Document ID: US20260076004A1
- Status: Published application
- Kind: A1
- Application number: 19/324,680
- Filed: 2025-09-10
- Published: 2026-03-12
- Earliest claimed: 2024-09-12
- Assignees: Lextar Electronics Corporation
- Applicants: Lextar Electronics Corporation
- Inventors: Chih-Hao LIN; Wei-Yuan MA; Jin-Shing TSENG; Chun-Xin YE
- Web page: https://patentgrep.com/patent/US20260076004A1

## CPC

- H10H 29/012: {of active-matrix LED displays}
- H10H 29/34: characterised by the geometry or arrangement of subpixels within a pixel, e.g. relative disposition of the RGB subpixels
- H10H 29/01: Manufacture or treatment
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

An LED chip configuration method is provided, comprising forming a plurality of LED chips from a wafer wherein the plurality of LED chips having the same color and different wavelengths; binning the plurality of LED chips into a first group having a minimum wavelength range, a second group having a first middle wavelength range, and a third group having a maximum wavelength range wherein the minimum wavelength range, the first middle wavelength range, and the maximum wavelength range are not overlapped with each other; providing a substrate; and disposing LED chips from the first group, the second group, and the third group on the substrate; wherein the disposed LED chips from different groups are arranged in a staggered manner.

## Claims

### Claim 1

An LED chip configuration method, comprising:
forming a plurality of LED chips from a wafer wherein the plurality of LED chips having the same color and different wavelengths;
binning the plurality of LED chips into a first group having a minimum wavelength range, a second group having a first middle wavelength range, and a third group having a maximum wavelength range wherein the minimum wavelength range, the first middle wavelength range, and the maximum wavelength range are not overlapped with each other;
providing a substrate; and
disposing LED chips from the first group, the second group, and the third group on the substrate;
wherein the disposed LED chips from different groups are arranged in a staggered manner.

### Claim 2 (depends on 1)

The LED chip configuration method as claimed in claim 1, wherein the binning step further comprising binning the plurality of LED chips into groups according to a wavelength interval.

### Claim 3 (depends on 1)

The LED chip configuration method as claimed in claim 1, wherein the wavelength ranges of the LED chips in the different groups are different.

### Claim 4 (depends on 1)

The LED chip configuration method as claimed in claim 1, wherein the LED chip from the first group is not adjacent to the LED chip from the third group.

### Claim 5 (depends on 1)

The LED chip configuration method as claimed in claim 1, wherein the LED chips from the same group are not adjacent to each other.

### Claim 6 (depends on 1)

The LED chip configuration method as claimed in claim 1, wherein the binning step further comprising binning the plurality of LED chips into a fourth group having a second middle wavelength range, the LED chip from the second group is disposed adjacent to the LED chip from the fourth group.

### Claim 7 (depends on 1)

The LED chip configuration method as claimed in claim 1, wherein the total wavelength range of the three groups is from 4 nm to 12 nm.

### Claim 8 (depends on 1)

The LED chip configuration method as claimed in claim 1, wherein each of the LED chips is packaged by a transparent encapsulant.

### Claim 9 (depends on 8)

The LED chip configuration method as claimed in claim 8, wherein the transparent encapsulant further includes a wavelength conversion material.

### Claim 10 (depends on 1)

The LED chip configuration method as claimed in claim 1, where the plurality of LED chips are blue LED chips.