Compact Laser Assembly For Reverse On-PCB Direct-Coupling

Abstract

A laser assembly is provided. The laser assembly includes a printed circuit board; a laser sub-assembly including a thermo-electric cooler and an optical train, wherein the laser sub-assembly is configured to connect to the printed circuit board such that the optical train is disposed between the printed circuit board and the thermo-electric cooler, wherein the thermo-electric cooler is configured to extract heat from the optical train outwardly from the printed circuit board, and wherein the laser assembly is configured to connect optically with a photonic integrated circuit via free space. Advantageously, the laser assembly includes a top-down approach where the thermo-electric cooler radiates heat outward, supports a pre-assembled approach, and uses free space connectivity for the laser path to the photonic integrated circuit, i.e., no fiber connections.

Dependencies are inferred from the claim text.