Substrate treating method

Abstract

The present invention relates to a substrate treating method for treating a substrate. The substrate treating method includes a development step, a treatment liquid supply step, a solidified film forming step, and a sublimation step. In the development step, a developer is supplied to a substrate. In the treatment liquid supply step, a treatment liquid is supplied to the substrate. The treatment liquid contains a sublimable substance and a solvent. In the solidified film forming step, the solvent of the treatment liquid evaporates from the treatment liquid on the substrate. In the solidified film forming step, the solidified film is formed on the substrate. The solidified film contains the sublimable substance. In the sublimation step, the solidified film sublimates.

Dependencies are inferred from the claim text.