Method of inspecting a risk of printing defect pattern in photolithography process

A method of inspecting a risk of printing defective pattern in photolithography process, comprising:

• providing a photomask pattern;
• generating an intensity curve of said photomask pattern in a first direction in an aerial image simulation, wherein said aerial image simulation has a threshold intensity, and said intensity curve is provided with a primary crest and a secondary crest adjacent to said primary crest, and said primary crest is higher than said secondary crest, and said threshold intensity is lower than said secondary crest, so that said threshold intensity intersects with said secondary crest to define an intensity region;
• partitioning said intensity region into a plurality of rectangular fragments arranged in said first direction;
• adding up areas of said rectangular fragments to obtain a total area;
• and
• when said total area is less than a specification value, it is determined that said photomask pattern has no risk of printing defective pattern in said photolithography process, and when said total area is greater than said specification value, it is determined that said photomask pattern has a risk of printing defective pattern in said photolithography process.

A computer program product with computer-executable instructions that are executed by a computer to perform a method of inspecting a risk of printing defective pattern in photolithography process, said method comprises:

• providing a photomask pattern;
• generating an intensity curve of said photomask pattern in a first direction in an aerial image simulation, wherein said aerial image simulation has a threshold intensity, and said intensity curve is provided with a primary trough and a secondary trough adjacent to said primary trough, and said primary trough is lower than said secondary trough, and said threshold intensity is higher than said secondary trough, so that said threshold intensity intersects with said secondary trough to define an intensity region;
• partitioning said intensity region into a plurality of rectangular fragments arranged in said first direction;
• adding up areas of said rectangular fragments to obtain a total area;
• and
• when said total area is less than a specification value, it is determined that said photomask pattern has no risk of printing defective pattern in said photolithography process, and when said total area is greater than said specification value, it is determined that said photomask pattern has a risk of printing defective pattern in said photolithography process.

A computer program product with computer-executable instructions that are executed by a computer to perform a method of inspecting a risk of printing defective pattern in photolithography process, said method comprises:

• providing a photomask pattern;
• generating an intensity curve of said photomask pattern in a first direction in an aerial image simulation, wherein said aerial image simulation has a threshold intensity, and said intensity curve is provided with a primary crest and a secondary crest adjacent to said primary crest, and said primary crest is higher than said secondary crest, and said threshold intensity is lower than said secondary crest, so that said threshold intensity intersects with said secondary crest to define an intensity region;
• partitioning said intensity region into a plurality of rectangular fragments arranged in said first direction;
• adding up areas of said rectangular fragments to obtain a total area;
• and
• when said total area is less than a specification value, it is determined that said photomask pattern has no risk of printing defective pattern in said photolithography process, and when said total area is greater than said specification value, it is determined that said photomask pattern has a risk of printing defective pattern in said photolithography process.