Joining method of dissimilar materials
AssigneeKabushiki Kaisha Toshiba
InventorsGo OBARA, Takashi OBARA, Yuta NAKAMOTO
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Abstract
A joining method of dissimilar materials, the dissimilar materials being a joining member and a joined member, the method including: performing surface treatment of a joining surface of the joining member; overlaying the joining member and the joined member; heating the joined member by irradiating a laser on a surface of the joining member at a side opposite to the joining surface, the laser being irradiated at an irradiation condition that forms a keyhole; and joining the joining member and the joined member.
Claims6
A joining method of dissimilar materials, the dissimilar materials being a joining member and a joined member, the method comprising:
- performing surface treatment of a joining surface of the joining member;
- overlaying the joining member and the joined member;
- heating the joined member by irradiating a laser on a surface of the joining member at a side opposite to the joining surface, the laser being irradiated at an irradiation condition that forms a keyhole;
- and
- joining the joining member and the joined member.
Dependencies are inferred from the claim text.