Chip for ultrasonic transducer, ultrasonic transducer, electronic device, and method for preparing chip
AssigneeHuike (Singapore) Holding Pte.Ltd.
InventorsYuwang XU, Ya WEI, Lizhong ZENG, Canhong DU
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Abstract
A chip for an ultrasonic transducer, an ultrasonic transducer, an electronic device, and a method for preparing a chip are provided. The chip is arranged below an acoustic layer, and the chip comprises: a substrate; a circuit module arranged in the substrate; and a conductive shielding layer arranged between the circuit module and the acoustic layer, wherein a projection of the conductive shielding layer on the substrate at least covers a projection of the circuit module on the substrate, and the conductive shielding layer is grounded.
Claims20
A chip for an ultrasonic transducer, arranged below an acoustic layer and comprising:
- a substrate;
- a circuit module arranged in the substrate;
- and
- a conductive shielding layer arranged between the circuit module and the acoustic layer, wherein a projection of the conductive shielding layer on the substrate at least covers a projection of the circuit module on the substrate, and the conductive shielding layer is grounded.
A method for preparing a chip configured to control an ultrasonic transducer, comprising:
- guiding, during polarization of an acoustic layer of the ultrasonic transducer, induced charges above the acoustic layer to ground through a conductive shielding layer arranged between a circuit module and the acoustic layer, wherein a projection of the conductive shielding layer on a substrate at least covers a projection of the circuit module on the substrate.
Dependencies are inferred from the claim text.