Techniques for temperature stabilizing at least one device

A method for temperature stabilizing at least one device, the method comprising:

• receiving a first temperature, wherein the first temperature is a function of (x) a temperature of an interior environment in a package and/or (y) a temperature of a package, wherein the package includes a package thermal conductor, and wherein the at least one device is on and/or in a thermal conductor;
• determining whether the first temperature is less than a first temperature threshold level;
• determining that the first temperature is less than the first temperature threshold level, then turning on a heater;
• determining that the first temperature is greater than the first temperature threshold level, then:
• turning off the heater;
• thermally coupling the thermal conductor and a thermal electric cooler when the first temperature is greater than a second temperature threshold level, then, wherein a thermally activated switch includes:
• the thermal electric cooler (TEC) including a first TEC surface thermally connected to the package thermal conductor, and a second TEC surface;
• a thermally activated actuator (TAA);
• and
• the thermal conductor (TC) including a TC surface;
• and
• thermally decoupling the thermal conductor and the thermal electric cooler when the first temperature and/or the temperature of the thermally activated actuator is less than the second temperature threshold level;
• wherein the second temperature threshold level is greater than the first temperature threshold level.

An apparatus for controlling a temperature of at least one component of an atomic sensor, the apparatus comprising:

• a package comprising a package thermal conductor;
• a thermal electric cooler (TEC) comprising a first TEC surface, thermally connected to the package thermal conductor, and a second TEC surface;
• a thermally activated actuator (TAA);
• a thermal conductor (TC) comprising a TC surface;
• the at least one component on the thermal conductor;
• and
• a heater on or in the thermal conductor and configured to heat the thermal conductor and the at least one component when a temperature of the thermal conductor and/or the temperature at least one of the at least one component falls below a first temperature threshold level;
• wherein the thermally activated actuator is configured to change position based on a temperature of the thermally activated actuator to form a thermal connection between a surface of the thermal conductor and the second TEC surface when the temperature of the thermally activated actuator exceeds a second temperature threshold level so that the TEC cools the thermal conductor and the at least one component and to break off thermal contact between the surface of the thermal conductor and the second TEC surface when the temperature of the thermally activated actuator falls below a third temperature threshold level.