Systems and methods of delivering power to an application specific integrated circuit
AssigneeArista Networks, Inc.
InventorsWarren Justin MEGGITT, Daniel John BYSTROM, Adam Michael HEMP
Life of this patent
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Abstract
Systems and methods for supplying high power from a power supply to an ASIC are disclosed. Embodiments may mount an ASIC on a host board on which the ASIC and utilize a separate daughter board to mount the power supply. Electrical connectors suitable for use with higher power level, such as pin-and-collar, type connectors are used to connect the daughter board to the host board such that high current may be carried from the power supply on the daughter board to the ASIC on the host board through these electrical connectors.
Claims20
A method for delivering high current to an ASIC, the method comprising:
- mounting the ASIC on a first side of a host board, the host board comprising a laminated printed circuit board (PCB);
- mounting one or more power connector pins on a second side of the host board opposite the first side,
- wherein the one or more power connector pins are positioned opposite the ASIC on the host board,
- wherein each of the one or more connector pins has a cylindrical post and a metallic flange connected to the post adjacent to a proximal end of the post, wherein the flange is electrically connected to one or more electrically conductive elements on the host board;
- mounting one or more power supplies on a daughter board;
- mounting one or more power connector sockets on the daughter board;
- mounting the daughter board on the host board, wherein each of the one or more power connector sockets mates with a corresponding one of the one or more power connector pins;
- and
- delivering power from the one or more power supplies on the daughter board through the one or more power connector sockets and the one or more power connector pins to the ASIC on the host board.
A system for providing power to an ASIC, comprising:
- a host board comprising an ASIC mounted on a first side of the host board;
- one of more power connector pins mounted on a second side of the host board, each power connector pin electrically coupled to the ASIC through one or more electrically conductive elements;
- a daughter board comprising a power supply on a first side of the daughter board;
- one or more power connector sockets mounted on the daughter board, wherein the daughter board is mounted on the host board by mating the one or more power connector pins mounted on the host board with a corresponding power connector socket mounted on the daughter board such that the power supply can supply power to the ASIC on the host board through the one or more power connector pins and power connector sockets.
A system for providing power to an ASIC, comprising:
- a host board comprising a first laminated printed circuit board (PCB) having an upper lamination and a lower lamination;
- an ASIC mounted on the upper lamination of the host board;
- one of more power connector pins mounted on the lower lamination, each power connector pin electrically coupled to the ASIC through one or more electrically conductive elements at least partially in the lower lamination;
- a daughter board comprising a second laminated PCB;
- a power supply on a first side of the daughter board;
- one or more power connector sockets mounted on a second side of the daughter board, wherein the daughter board is mounted on the host board by mating the one or more power connector pins mounted on the host board with a corresponding power connector socket mounted on the daughter board such that the power supply and the ASIC are distal from one another when the daughter board is mounted on the host board and the power supply can supply power to the ASIC on the host board through the one or more power connector pins and power connector sockets.
Dependencies are inferred from the claim text.