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US 2026/0068032 A1Published application
Printed circuit board, battery pack, and method of manufacturing printed circuit board
AssigneeSamsung SDI Co., Ltd.
InventorTae Jin Lee
Life of this patent
Estimating the term…
Abstract
Disclosed are a printed circuit board, a battery pack, and a method of manufacturing a printed circuit board. The printed circuit board may include a substrate, a large current stage part disposed in a mounting area of the substrate, and a coating layer including phase change materials (PCMs) and covering the large current stage part.
Claims20
A printed circuit board comprising:
- a substrate;
- a large current stage part disposed in a mounting area of the substrate;
- and
- a coating layer comprising phase change materials (PCMs) and covering the large current stage part.
1 more element
A battery pack comprising:
- a plurality of battery cells;
- a case on which the plurality of battery cells is mounted;
- and
- a printed circuit board connected to the plurality of battery cells and the case,
- wherein the printed circuit board comprises a substrate, a large current stage part disposed in a mounting area of the substrate, and a coating layer that covers the large current stage part.
2 more elements
A method of manufacturing a printed circuit board, comprising:
- providing a substrate;
- disposing a large current stage part in a mounting area of the substrate;
- and
- forming a coating layer comprising phase change materials (PCMs) so that the coating layer covers the large current stage part.
1 more element
Dependencies are inferred from the claim text.