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US 2026/0066221 A1Published application
Substrate processing apparatus and substrate processing method
AssigneeSCREEN Holdings Co., Ltd.
InventorsKota TANIKAWA, Manabu TAKUSARI, Hiroyuki YASHIKI
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Abstract
A substrate processing apparatus includes an electrostatic charging unit and a processing unit. The electrostatic charging unit includes an electrostatic charger positively charging a first main surface of a substrate. The processing unit includes a processing chamber, and performs a process which includes at least one of heating of the substrate in the processing chamber and supply of a processing gas to the substrate and which involves the generation of metal ions in the processing chamber.
Claims24
A substrate processing apparatus comprising:
- an electrostatic charging unit including an electrostatic charger positively charging a first main surface of a substrate having said first main surface and a second main surface;
- and
- a processing unit including a processing chamber and performing a process including at least one of heating of said substrate in said processing chamber and supply of a processing gas to said substrate, said process involving generation of metal ions in said processing chamber.
A method of processing a substrate, comprising:
- positively charging a first main surface of a substrate having said first main surface and a second main surface;
- and
- performing a process including at least one of heating of said substrate in a processing chamber and supply of a processing gas to said substrate, said process involving generation of metal ions in said processing chamber.
Dependencies are inferred from the claim text.