US 2026/0066162 A1Published application

Multi-layer coil structure, inductor, and method for manufacturing multilayer coil structure

AssigneeInMicro Integrated Magnetic Technology Co., Ltd.

InventorsFujian DING, Shiwei CHEN, Siyuan SUN

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Abstract

The present disclosure provides a multi-layer coil structure, an inductor, and a method for manufacturing the multi-layer coil structure. The multi-layer coil structure includes subcoils arranged in a stacked manner, where each subcoil includes a bottom coil, an insulating film, and a top coil, a contact is arranged in a through hole of the insulating film, outer surfaces of the bottom coil and the top coil are both provided with an insulating layer, and the insulating layer is provided with a via hole; via holes in adjacent subcoils are aligned with each other, and metal contacts are arranged in the via holes. The problem of insulation in a multi-layer multi-turn coil is solved.

Claims11

Dependent claims

A multi-layer coil structure, comprising:

at least two subcoils arranged in a stacked manner, wherein each of the at least two subcoils comprises a bottom coil, an insulating film arranged on the bottom coil, and a top coil arranged on the insulating film, the insulating film comprises at least one through hole, a contact is arranged in the at least one through hole so that the bottom coil and the top coil located on two sides of the insulating film are in electrical contact with each other, outer surfaces of the bottom coil and the top coil are both provided with an insulating layer, and the insulating layer is provided with a via hole;
via holes in adjacent subcoils of the at least two subcoils are aligned with each other, and metal contacts are arranged in the via holes so that the adjacent subcoils are in electrical contact with each other;
and
the at least one through hole and the via hole in a same subcoil are arranged in a staggered manner.

1 more element

A method for manufacturing a multi-layer coil structure, comprising the following steps:

S1, preparing at least two full-board double-sided coils, each of the at least two full-board double-sided coils comprising two or more subcoils arranged in an array, and each of the two or more subcoils being a double-sided coil;
S2, subjecting each of the at least two full-board double-sided coils to insulation processing, so that an outer surface of each of the double-sided coils is coated with an insulating layer;
S3, forming via holes for coils to be in communication with outside by removing an insulating layer corresponding to a head end of each bottom coil of a full-board double-sided coil of the at least two full-board double-sided coils located at a top layer, removing an insulating layer corresponding to a tail end of each top coil of a full-board double-sided coil of the at least two full-board double-sided coils located at a bottom layer, and removing insulating layers corresponding to head ends of bottom coils and tail ends of top coils of full-board double-sided coils of the at least two full-board double-sided coils located in a middle between the bottom layer and the top layer;
S4, filling via holes in top coils with a conductive material, a height of the conductive material being greater than twice a height of a peripheral insulating layer of the top coils;
S5, stacking and attaching two or more full-board double-sided coils of the at least two full-board double-sided coils subjected to processing in the S2, the S3 and the S4, and aligning via holes in two adjacent full-board double-sided coils of the at least two full-board double-sided coils on a one-to-one basis;
S6, heating, so that insulating layers of the adjacent full-board double-sided coils are adhered and fixed;
and
S7, cutting to obtain single coils formed by stacking the two or more subcoils.

5 more elements

Dependencies are inferred from the claim text.