# US 2026/0062284 A1 · Transducer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0062284 A1 - Document ID: US20260062284A1 - Status: Published application - Kind: A1 - Application number: 19/312,787 - Filed: 2025-08-28 - Published: 2026-03-05 - Earliest claimed: 2024-08-29 - Assignees: Seiko Epson Corporation - Applicants: Seiko Epson Corporation - Inventors: Teruo TAKIZAWA; Shota KIGURE - Web page: https://patentgrep.com/patent/US20260062284A1 ## CPC - B81B 7/0038: {using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters} - B81B 3/0051: {For defining the movement, i.e. structures that guide or limit the movement of an element (mechanical arrangements for preventing or damping vibration or shock H01H3/60)} - B81C 1/00269: {Bonding of solid lids or wafers to the substrate} - B81C 1/00285: {using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters} - G01P 15/0802: {Details} - G01P 15/125: by capacitive pick-up - G01P 15/18: in two or more dimensions - B81B 2201/0235: Accelerometers - B81B 2203/0136: Comb structures - B81B 2203/04: Electrodes - B81C 2203/0109: Bonding an individual cap on the substrate - B81C 2203/019: characterised by the material or arrangement of seals between parts - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - G01P: MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT (measuring or recording blood flow A61B5/02, A61B8/06; monitoring speed or deceleration of electrically-propelled vehicles B60L3/00; vehicle lighting systems adapted to indicate speed B60Q1/54; determining position or course in navigation, measuring ground distance in geodesy or surveying G01C; combined measuring devices for measuring two or more variables of movement G01C23/00; measuring velocity of sound G01H; measuring velocity of light G01J7/00; measuring direction or velocity of solid objects by reception or emission of radiowaves or other waves and based on propagation effects, e.g. Doppler effect, propagation time, direction of propagation, G01S; measuring speed of nuclear radiation G01T; measuring acceleration of gravity G01V; {measuring or recording the speed of trains B61L23/00; speed indicators incorporated in motor vehicles B60K35/00; measuring frequency or phase G01R; traffic control G08G}) ## Abstract A transducer includes a first substrate; a second substrate that is disposed to overlap the first substrate and is provided with an insulating layer on a surface of the second substrate; a functional element provided between the first substrate and the second substrate; and a metal eutectic layer that bonds the first substrate and the second substrate to each other in a bonding region positioned around the functional element, in which a recess is provided in a first surface of the second substrate on the first substrate side, the recess is configured with a second surface that is a bottom, and a side wall that connects the first surface and the second surface, the insulating layer includes a first portion provided on the first surface, a second portion provided on the side wall, and a third portion provided on the second surface, and the bonding region is disposed between the second portions when viewed in plan in a Y axis direction along a Y axis. ## Claims ### Claim 1 A transducer comprising, when three axes orthogonal to each other are set as an X axis, a Y axis, and a Z axis: a first substrate; a second substrate that is disposed to overlap the first substrate in a Z axis direction along the Z axis and is provided with an insulating layer on a surface of the second substrate; a functional element provided between the first substrate and the second substrate; and a metal eutectic layer that bonds the first substrate and the second substrate to each other in a bonding region positioned around the functional element, wherein a recess is provided in a first surface of the second substrate on the first substrate side, the recess is configured with a second surface that is a bottom, and a side wall that connects the first surface and the second surface, the insulating layer includes a first portion provided on the first surface, a second portion provided on the side wall, and a third portion provided on the second surface, and the bonding region is disposed between second portions, each of which is the second portion of the insulating layer, when viewed in plan in a Y axis direction along the Y axis. ### Claim 2 (depends on 1) The transducer according to claim 1, wherein the metal eutectic layer contains a first metal and a second metal, and the insulating layer is any one of a silicon oxide layer, a silicon nitride layer, a boron oxide layer, and a bismuth oxide layer. ### Claim 3 (depends on 2) The transducer according to claim 2, further comprising, when viewed in plan from the Z axis direction: a wiring line that extends from an outside of the second substrate, intersects the bonding region, and is electrically coupled to the functional element, wherein, when a width of a portion of the metal eutectic layer that overlaps the wiring line is denoted by w1, and a width of a portion of the metal eutectic layer that does not overlap the wiring line is denoted by w2, w ⁢ 1 > w ⁢ 2 is satisfied. ### Claim 4 (depends on 3) The transducer according to claim 3, wherein, when a height of a portion of the metal eutectic layer that overlaps the wiring line is denoted by t1, and a height of a portion of the metal eutectic layer that does not overlap the wiring line is denoted by t2, t ⁢ 1 < t ⁢ 2 is satisfied. ### Claim 5 (depends on 2) The transducer according to claim 2, wherein the first metal has aluminum as a main component, and the second metal has germanium as a main component.