US 2026/0062282 A1 · MEMS MICROPHONE CHIP

Abstract

The present disclosure discloses a MEMS microphone chip. The diaphragm of the MEMS microphone chip is suspended on the substrate by a plurality of elastic connection portions connected with the vibration portion of the diaphragm. The vibration portion includes a central vibration portion and an outer vibration portion connected with the central vibration portion and the plurality of elastic connection portions. The back plate includes an anchor portion extending towards the diaphragm. The anchor portion is fixedly connected with the central vibration portion. Therefore, the diaphragm is mounted on the substrate by the plurality of elastic connection portions. The central vibration portion is anchored to the back plate by the anchor portion. The MEMS microphone chip in the present disclosure has higher reliability.

Claims9

Dependent claims

A MEMS microphone chip comprising:

a substrate having a back cavity;
a capacitance system mounted on the substrate and covering the back cavity, including:
a diaphragm, including:
a vibration portion, and
a plurality of elastic connection portions extended from an edge of the vibration portion to be fixed to the substrate;
and
a back plate spaced apart from the diaphragm, including an anchor portion extended towards the diaphragm;
wherein
the vibration portion includes a central vibration portion and an outer vibration portion connected with the central vibration portion and the plurality of elastic connection portions;
the anchor portion is fixedly connected with the central vibration portion.

7 more elements

Dependencies are inferred from the claim text.

Mems microphone chip

Life of this patent

Mems microphone chip

Life of this patent

Abstract

Claims9