Injection molding apparatus and mold clamping device
AssigneeSeiko Epson Corporation
InventorTetsuya TAMURA
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AssigneeSeiko Epson Corporation
InventorTetsuya TAMURA
Estimating the term…
An injection molding apparatus includes an injection unit, a mold clamping unit, and a controller. The mold clamping unit includes a toggle fixing plate, a fixed mold attachment portion, a movable mold attachment portion movable in a mold clamping direction, a motor, a ball screw configured rotated by the motor, a crosshead configured to move between the toggle fixing plate and the movable mold attachment portion due to rotation of the ball screw, and a toggle section coupled to the toggle fixing plate. The movable mold attachment portion and the crosshead are configured to move the movable mold attachment portion. A position detector is configured to detect a position of the crosshead. The controller controls the position of the crosshead based on a detection result of the position detector to make the toggle section operate to perform the mold clamping of the fixed mold and the movable mold.
An injection molding apparatus configured to perform injection molding of a molded article using a molding die configured with a fixed mold and a movable mold, the apparatus comprising:
A mold clamping device comprising:
Dependencies are inferred from the claim text.