Injection molding apparatus and material ejection device
AssigneeSeiko Epson Corporation
InventorsTaiki AKIYAMA, Ryoma WATANABE
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AssigneeSeiko Epson Corporation
InventorsTaiki AKIYAMA, Ryoma WATANABE
Estimating the term…
An injection molding apparatus includes an injection unit configured to inject a plasticized material obtained by plasticizing a material of the molded article into the molding die, a mold clamping unit to which the molding die is attached and which is configured to perform mold clamping on the molding die, and a controller configured to control the injection unit and the mold clamping unit, wherein the injection unit includes a plasticizing unit configured to plasticize the material to generate the plasticized material, a nozzle configured to supply the plasticized material to the molding die, a flow path configured to communicate the plasticizing unit and the nozzle with each other, and a supply adjustment mechanism provided to the flow path and configured to adjust a supply amount of the plasticized material from the nozzle to the molding die, the supply adjustment mechanism includes a cylinder coupled to the flow path, a plunger disposed in the cylinder, and a driver configured to drive the plunger, and the flow path and the cylinder are integrally formed of a first member.
An injection molding apparatus configured to perform injection molding of a molded article using a molding die including a fixed mold and a movable mold that is movable relatively to the fixed mold, the apparatus comprising:
A material ejection device comprising:
Dependencies are inferred from the claim text.