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AssigneeAurora Operations, Inc.
InventorsJames Ferrara, Pruthvi Jujjavarapu, Sen Lin, Andrew Steil Michaels, Gevorg Martuni Nahapetian, Parth Panchal, Imbert Yuyen Wang
Estimating the term…
The present disclosure is directed to a manufacturing process for a LIDAR system with individualized semiconductor optical amplifier (SOA) dies including: (a) forming a plurality of SOA regions on a semiconductor wafer; (b) dicing the semiconductor wafer to produce a plurality of individualized SOA dies, the plurality of individualized SOA dies respectively including the plurality of SOA regions; (c) aligning the plurality of individualized SOA dies with one or more array inputs, the one or more array inputs configured to provide a beam from a light source to the plurality of individualized SOA dies; and (d) aligning the plurality of individualized SOA dies with one or more array outputs, the one or more array outputs configured to provide the beam from the plurality of individual SOA dies to an emitter.
A system for manufacturing a semiconductor device for a LIDAR system for a vehicle, the system operable to:
A system for manufacturing a semiconductor device for a LIDAR system for a vehicle, the system operable to:
Dependencies are inferred from the claim text.