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US 2026/0055249 A1Published application
Polyamide-based resin foam particle and polyamide-based resin foam particle molded article
AssigneeJsp Corporation
InventorKatsuyuki SUENAGA
Life of this patent
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Abstract
A polyamide-based resin expanded bead comprising a polyamide-based resin as a base resin, wherein the expanded bead comprises a carbon nanotube, and the expanded bead has a closed cell ratio of 70% or more.
Claims6
A polyamide-based resin expanded bead comprising a polyamide-based resin as a base resin, wherein
- the expanded bead comprises a carbon nanotube, and
- the expanded bead has a closed cell ratio of 70% or more.
Dependencies are inferred from the claim text.