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US 2026/0054903 A1Published application
Vapor-deposited substrate, packaging material laminate, packaging container, and packaged article
AssigneeToppan Holdings Inc.
InventorsMasayoshi SUZUTA, Nobuhiko IMAI, Chiaki KATO, Soichi HATA, Ryuichi NAKAMURA, Katsuhiro SUZUKI
Life of this patent
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Abstract
A vapor-deposited substrate is formed by forming a vapor-deposited layer on a substrate. The substrate is a polyolefin resin film containing recycled resin, and the recycled resin is a chemically recycled resin. A packaging material laminate includes the vapor-deposited substrate and a sealing layer.
Claims10
A vapor-deposited substrate formed by forming a vapor-deposited layer on a substrate, wherein the substrate is a polyolefin resin film containing recycled resin, and the recycled resin is a chemically recycled resin.
Dependencies are inferred from the claim text.