Method, device and components for manufacturing embedded optics for photonic components

A method for manufacturing an embedded optics for photonic components, said photonic components being suitable for emitting or capturing an electromagnetic radiation of a given frequency, said optics being made of a thermoplastic material with a melting temperature Tm, said thermoplastic material being suitable for transmitting said electromagnetic radiation, said photonic component being on a physical carrier, wherein the method uses a containment structure comprising a thermostatted cavity, suitable for being filled with said thermoplastic material, where said thermostatted cavity is open, and a support structure, suitable for supporting said physical carrier on said cavity such that said photonic component is inside said cavity, where when said physical carrier is supported by said support structure, said thermostatted cavity is partially open, where said method comprises the following steps:

• [a] melting said thermoplastic material,
• [b] positioning said physical carrier with said photonic component on said support structure, such that said photonic component is inside said thermostatted cavity and said thermostatted cavity being partially open,
• [c] filling said thermostatted cavity with said molten thermoplastic material in a filling unit, where said thermostatted cavity is kept at a temperature Tc greater than Tm during the step of filling said thermostatted cavity by means of a temperature control system,
• [d] once said thermostatted cavity is filled, cooling said thermostatted cavity below said Tm,
• [e] ejecting said photonic component, coated with said thermoplastic material, from said thermostatted cavity by means of ejectors.