Release film, method for producing the same, and packaging apparatus

A packaging apparatus, comprising:

• a packaging mold recessed to form an accommodating groove;
• and
• a release film disposed in the accommodating groove, wherein the release film includes:
• a PET base layer disposed at a bottom surface of the accommodating groove of the packaging mold;
• and
• a release layer formed by coating a coating liquid onto the PET base layer, wherein the coating liquid includes a base material and inorganic particle dispersed in the base material, and wherein a glass transition temperature (Tg) of the base material is between −60° C. and −30° C., an average particle size of the inorganic particle is between 8 μm and 12 μm, a thickness of the release layer is between 5 μm and 20 μm, and a surface roughness (Ra) of the release layer is between 0.4 μm and 0.8 μm;
• wherein the release layer of the release film is configured to be in contact with an epoxy resin, and a release force between the release layer and the epoxy resin is between 50 gf/inch and 400 gf/inch.

A method for producing a release film, comprising:

• a coating liquid preparing process implemented by adding inorganic particle into a solvent and stirring at a stirring speed of between 1,000 rpm and 2,000 rpm for 2 minutes to 8 minutes, and then adding a base material and stirring at a stirring speed of between 1,000 rpm and 2,000 rpm for 12 minutes to 18 minutes to form a coating liquid, wherein a glass transition temperature (Tg) of the base material is between −60° C. and −30° C., and an average particle size of the inorganic particle is between 8 μm and 12 μm;
• and
• a coating process implemented by coating the coating liquid onto a PET base layer to form a release layer thereon so as to form a release film, wherein a thickness of the release layer is between 5 μm and 20 μm, and a surface roughness (Ra) of the release layer is between 0.4 μm and 0.8 μm;
• wherein the release layer of the release film is configured to be in contact with an epoxy resin, and a release force between the release layer and the epoxy resin is between 50 gf/inch and 400 gf/inch.