Substrate bonding system and substrate bonding method
AssigneeBondtech Co., Ltd.
InventorAkira YAMAUCHI
Life of this patent
Estimating the term…
Abstract
A substrate bonder includes a gas discharge hole (1413c, 1423c) provided in a second region in a stage and a head, and a controller that controls a chuck drive unit and a gas supply unit (1492) to release holding of a substrate with an electrostatic chuck (1413, 1423) and discharge gas from the gas discharge hole (1413c, 1423c) in a state where a peripheral portion of the substrate is held by the electrostatic chuck before bringing central portions of the substrates into contact with each other. The stage and the head include grooves (1413d, 1423d) provided in the second region and communicating with the gas discharge holes (1413c, 1423c).
Claims39
A substrate bonding system that bonds a first substrate and a second substrate, the substrate bonding system comprising:
- a first substrate holding unit that holds the first substrate;
- a second substrate holding unit that holds the second substrate in a state where a bonding surface of the second substrate faces a bonding surface of the first substrate;
- at least one first electrostatic chuck provided in a first region facing a peripheral portion of the first substrate disposed at a substrate holding position set in advance in the first substrate holding unit;
- at least one second electrostatic chuck that is provided in a second region inside the first region in the first substrate holding unit and holds a portion facing the second region in the first substrate disposed at the substrate holding position;
- a chuck drive unit that individually drives the first electrostatic chuck and the second electrostatic chuck;
- a gas discharge unit that is provided in the second region of the first substrate holding unit and discharges gas toward the first substrate;
- a gas supply unit that supplies gas to the gas discharge unit;
- and
- a controller that releases holding of the first substrate with the second electrostatic chuck and controls the chuck drive unit and the gas supply unit to discharge gas from the gas discharge unit in a state where the peripheral portion of the first substrate is held by the first electrostatic chuck before bringing a central portion of the bonding surface of the first substrate and a central portion of the bonding surface of the second substrate into contact with each other,
- wherein the first substrate holding unit includes a first recess provided in the second region and communicating with the gas discharge unit.
-38. (canceled)
-55. (canceled)
A substrate bonding method for bonding a first substrate and a second substrate, the method comprising:
- a step of causing a first electrostatic chuck provided in a first region facing a peripheral portion of the first substrate disposed at a substrate holding position set in advance in the first substrate holding unit to hold the peripheral portion of the first substrate;
- a step of causing a second substrate holding unit to hold the second substrate in a state where a bonding surface of the second substrate faces a bonding surface of the first substrate;
- a step of causing a gas discharge unit in the first substrate holding unit having a first recess to discharge gas to the first recess, the first recess being provided in a second region inside the first region and communicating with the gas discharge unit, in a state where the peripheral portion of the first substrate is held by the first electrostatic chuck;
- and
- a step of, after the gas is discharged to the first recess, causing a central portion of the bonding surface of the first substrate and a central portion of the bonding surface of the second substrate to come into contact with each other.
(canceled)
-74. (canceled)
Dependencies are inferred from the claim text.