Wafer cleaning device
AssigneeSamsung Electronics Co., Ltd.
InventorsMinki Kim, Kyoungwhan Oh, Hoseop Choi
Life of this patent
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Abstract
A wafer cleaning device includes a plurality of brush systems arranged in a line in a first direction and configured to clean a wafer. Each of the plurality of brush systems includes a body having a tube shape extending in the first direction, a nodule arranged on an outer surface of the body, and a driveshaft extending in the first direction and configured to integrally rotate with the body. The plurality of brush systems are configured to independently rotate with the first direction as a rotation axis.
Claims20
A wafer cleaning device comprising:
- a plurality of brush systems arranged in a line in a first direction and configured to clean a wafer,
- wherein each brush system of the plurality of brush systems includes:
- a body having a tube shape extending in the first direction;
- a nodule arranged on an outer surface of the body;
- and
- a driveshaft extending in the first direction and configured to integrally rotate with the body, and
- wherein each brush system of the plurality of brush systems is configured to independently rotate about the first direction as a rotation axis.
A wafer cleaning device comprising:
- a first brush system, a second brush system, and a third brush system that are arranged in a line in a first direction and configured to clean a wafer,
- wherein the first brush system includes a first body having a tube shape extending in the first direction, a first nodule arranged on an outer surface of the first body, and a first driveshaft extending in the first direction and configured to integrally rotate with the first body,
- wherein the second brush system includes a second body having a tube shape extending in the first direction, a second nodule arranged on an outer surface of the second body, and a second driveshaft extending in the first direction and configured to integrally rotate with the second body, and
- wherein the third brush system includes a third body having a tube shape extending in the one direction, a third nodule arranged on an outer surface of the third body, and a third driveshaft extending in the first direction and configured to integrally rotate with the third body, and
- wherein the wafer cleaning device comprises:
- a first fluid supply pipe inside the first body and configured to eject a first fluid to the first body;
- a second fluid supply pipe inside the second body and configured to eject a second fluid to the second body;
- and
- a third fluid supply pipe inside the third body and configured to eject a third fluid to the third body.
A wafer cleaning device comprising:
- a first brush structure including a first brush system, a second brush system, and a third brush system that are arranged in a line in one direction and configured to clean a wafer;
- and
- a second brush structure including a fourth brush system, a fifth brush system, and a sixth brush system that are arranged from the third brush system in a line in the one direction and configured to clean the wafer,
- wherein each of the first brush system, the second brush system, the third brush system, the fourth brush system, the fifth brush system, and the sixth brush system includes:
- an inner housing having a tube shape in the first direction;
- an outer housing extending in the first direction and having a tube shape having a hollow accommodating the inner housing;
- a body extending in the first direction and having a tube shape having a hollow accommodating the outer housing;
- a nodule on an outer surface of the body;
- a driveshaft in the inner housing and configured to integrally rotate with the body;
- and
- a fluid supply pipe between the inner housing and the outer housing and configured to eject fluid to the body, and
- wherein the first brush system, the second brush system, the third brush system, the fourth brush system, the fifth brush system, and the sixth brush system are configured to independently rotate with the first direction as a rotation axis, and the respective fluid supply pipes of the first brush system, the second brush system, the third brush system, the fourth brush system, the fifth brush system, and the sixth brush system are configured to independently eject the fluid.
Dependencies are inferred from the claim text.