Wire bond obstruction mitigation using wire bond stud bumps

A method, comprising:

• placing a set of stud bumps on a substrate defining a boundary of a first location for placement of a first component;
• placing the first component in the first location on the substrate via a layer of a first binding material;
• placing a second component at a second location on the substrate via a layer of a second binding material, the second location being adjacent to an edge stud bump of the set of stud bumps and outside of the boundary of the first location;
• and
• forming a wire bond between the first component and the second component, wherein the edge stud bump comprises a greater amount wire bonding material than another stud bump of the set of stud bumps.

A microelectronic assembly, comprising:

• a substrate having a set of stud bumps disposed thereon, wherein the set of stud bumps define a boundary of a first location;
• a first component disposed at the first location on the substrate via a layer of a first binding material;
• a second component disposed at a second location on the substrate via a layer of a second binding material, wherein the second location is adjacent to an edge stud bump of the set of stud bumps and outside of the boundary of the first location;
• and
• a wire bond formed between the first component and the second component, wherein the wire bond is formed from the edge stud bump that comprises a greater amount of wire bonding material than another stud bump of the set of stud bumps.

A microelectronic assembly, comprising:

• a substrate having a set of stud bumps disposed thereon, wherein the set of stud bumps comprises a first stud bump and a second stud bump, the first stud bump comprising a greater amount of wire bonding material than the second stud bump;
• a component disposed at a location on the substrate via a layer of a binding material, wherein the set of stud bumps define a boundary of the location for the component;
• and
• a wire bond formed between the component and the first stud bump.