Packaging substrate and method of manufacturing the same
AssigneeAbsolics Inc.
InventorDONGJUN SHIN
Life of this patent
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Abstract
According to the present disclosure, a packaging substrate includes a glass core and an adhesion reinforcement layer disposed on the glass core. The adhesion reinforcement layer includes a first adhesion reinforcement layer and a second adhesion reinforcement layer disposed on the first adhesion reinforcement layer. The first adhesion reinforcement layer includes a transition metal and silicon. The second adhesion reinforcement layer includes a transition metal. In such a case, it is possible to improve the bonding strength of the conductive layer with respect to the glass core, while effectively suppressing damage to the packaging substrate caused by the difference in thermal expansion properties between the glass core and the conductive layer.
Claims11
A packaging substrate, comprising:
- a glass core;
- and
- an adhesion reinforcement layer disposed on the glass core,
- wherein the adhesion reinforcement layer comprises a first adhesion reinforcement layer and a second adhesion reinforcement layer disposed on the first adhesion reinforcement layer,
- the first adhesion reinforcement layer comprises a transition metal and silicon, and
- the second adhesion reinforcement layer comprises a transition metal.
A method of manufacturing a packaging substrate, comprising:
- a preparation step of providing a base substrate including a glass core and a thin film for forming an adhesion reinforcement layer disposed on the glass core;
- a heat treatment step of forming a post-heat treatment substrate including the adhesion reinforcement layer by heat-treating the base substrate;
- and
- a fabrication step of manufacturing the packaging substrate from the post-heat treatment substrate,
- wherein the thin film for forming the adhesion reinforcement layer includes a transition metal,
- the adhesion reinforcement layer comprises a first adhesion reinforcement layer and a second adhesion reinforcement layer disposed on the first adhesion reinforcement layer,
- the first adhesion reinforcement layer comprises a transition metal and silicon, and
- the second adhesion reinforcement layer comprises a transition metal.
Dependencies are inferred from the claim text.