Semiconductor device manufacturing equipment

Semiconductor-device manufacturing equipment comprising:

• a stage configured to support a substrate;
• a head module disposed on top of the stage, the head module including a first bonding head and a second bonding head spaced apart from each other, wherein the head module is configured to bond a plurality of dies onto the substrate;
• and
• a controller configured to place the head module in a first state,
• wherein in the first state, the head module is configured to move in a first direction and to move along an arc path around the first bonding head to a target position on the substrate,
• wherein, at the target position, the first bonding head is configured to descend and bond a first die on a first non-defective chip of the substrate, and
• wherein, at the target position, the second bonding head is configured to descend and bond a second die on a second non-defective chip of the substrate.

Semiconductor-device manufacturing equipment comprising:

• a stage configured to support a substrate;
• a head module disposed on top of the stage, the head module including a first bonding head and a second bonding head spaced apart from each other, wherein the head module is configured to bond a plurality of dies onto the substrate;
• and
• a controller configured to cause the head module to move to a first position along a first direction,
• wherein, at the first position, the first bonding head is configured to descend to perform a first bonding operation on a first chip,
• wherein, at the first position, the second bonding head is configured to descend to perform a second bonding operation on a second chip positioned along the first direction with the first chip,
• wherein a spacing between the first bonding head and the second bonding head is wide enough to cover a width of at least one chip.