Substrate processing with reduction of pressure and hydration before development
AssigneeTokyo Electron Limited
InventorsSoichiro OKADA, Ken ANDO, Hiroki TADATOMO, Arnaud Alain Jean DAUENDORFFER
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AssigneeTokyo Electron Limited
InventorsSoichiro OKADA, Ken ANDO, Hiroki TADATOMO, Arnaud Alain Jean DAUENDORFFER
Estimating the term…
A substrate processing method includes: forming a photosensitive film on a surface of a substrate; accommodating the substrate with the formed photosensitive film in a first chamber and exposing the photosensitive film to exposure light in the first chamber; accommodating the substrate with the formed photosensitive film in a second chamber different from the first chamber and performing a pressure reduction process to reduce pressure inside the second chamber to a subatmospheric pressure; subjecting, after the pressure reduction process, the photosensitive film to a moisture-containing gas; and developing the photosensitive film of the substrate after exposing and subjecting.
A substrate processing method comprising:
A substrate processing apparatus comprising:
A non-transitory memory device having instructions stored thereon that, in response to execution by a processing device, cause the processing device to control a substrate processing apparatus to:
Dependencies are inferred from the claim text.