Mounting device

An apparatus for manufacturing a semiconductor device, the apparatus configured to attach an adhesive film to an attachment surface of a workpiece, the apparatus comprising:

• a chamber comprising a housing and a cover relatively movable with respect to the housing;
• and
• a stage accommodated in the chamber,
• wherein the stage is configured to secure the workpiece, and to be relatively movable with respect to the cover,
• wherein the cover is configured to contact the housing to provide a processing space in the chamber, and comprises an elastic layer, a cover body, and a cooling part,
• wherein the processing space is configured to attach the adhesive film to the workpiece,
• wherein the elastic layer:
• is disposed at a lower surface of the cover body to face the stage,
• has a first surface configured to attach the adhesive film on the attachment surface of the workpiece,
• has a second surface which is facing away from the first surface,
• is configured to be deformed to follow a surface shape of the attachment surface of the workpiece, and
• is configured to deform the adhesive film to follow a shape of the elastic layer,
• wherein the lower surface faces the second surface of the elastic layer,
• wherein the cover body has a ventilation hole fluidly communicating with the second surface of the elastic layer,
• wherein the cooling part is disposed between the second surface of the elastic layer and lower surface of the cover body, and
• wherein the cooling part is configured to cool the elastic layer.

An apparatus for manufacturing a semiconductor device, the apparatus configured to attach an adhesive film to an attachment surface of a workpiece, the apparatus comprising:

• a chamber comprising a housing having a discharge opening and a cover relatively movable with respect to the housing;
• and
• a stage having a stage main body accommodated in the chamber, a holding chuck configured to secure the workpiece, and a heater configured to heat the workpiece,
• wherein the cover is configured to contact with the housing to provide a processing space in the chamber,
• where the processing space is configured to:
• attach the adhesive film to the workpiece within the processing space under a depressurized condition, and
• adjust the discharge opening to provide the depressurized condition,
• wherein the stage is configured to be relatively movable with respect to the cover,
• wherein the cover comprises an elastic layer, a cover body having a ventilation hole, and a cooler,
• wherein the elastic layer:
• is disposed at a lower surface of the cover body to face the holding chuck of the stage,
• has a first surface configured to secure the adhesive film,
• has a second surface facing away from the first surface,
• is configured to be deformed to follow a surface shape of the attachment surface of the workpiece,
• is configured to deform the adhesive film to follow a shape of the elastic layer, and
• is configured to expand and to contract such that the adhesive film is deformed to follow the expansion or contraction of the elastic layer,
• wherein the cover is configured to introduce gas through the ventilation hole to expand the elastic layer,
• wherein the cover is configured to discharge gas through the ventilation hole to contract the elastic layer, wherein the lower surface faces the second surface of the elastic layer,
• wherein the cooler is disposed between the second surface of the elastic layer and the lower surface of the cover body, and
• wherein the cooler is in contact with the elastic layer and configured to cool the elastic layer.