Back to results
US 2026/0052801 A1Published application
Semiconductor structure with chirp layer
AssigneeSilanna UV Technologies Pte Ltd
InventorsNorbert Krause, Guilherme Tosi
Life of this patent
Estimating the term…
Abstract
A semiconductor structure can comprise a plurality of first semiconductor layers comprising wide bandgap semiconductor layers, a narrow bandgap semiconductor layer, and a chirp layer between the plurality of first semiconductor layers and the narrow bandgap semiconductor layer. The plurality of first semiconductor layers can comprise a first short-period superlattice (SPSL). The chirp layer can comprise alternating layers of GaN layers and AlN layers. An average composition of Al/(Al+Ga) of the chirp layer changes throughout the chirp layer.
Claims13
A semiconductor structure comprising:
- a plurality of first semiconductor layers comprising wide bandgap semiconductor layers;
- a narrow bandgap semiconductor layer;
- and
- a chirp layer between the plurality of first semiconductor layers and the narrow bandgap semiconductor layer;
- wherein:
- the plurality of first semiconductor layers comprise a short-period superlattice (SPSL);
- the chirp layer comprises alternating layers of GaN layers and AlN layers;
- and
- an average composition of Al/(Al+Ga) of the chirp layer changes throughout the chirp layer.
6 more elements
Dependencies are inferred from the claim text.