Method of providing an electrically conductive layer to a plastic housing by insertion molding of a conductive film
AssigneeAptiv Technologies AG
InventorsMichal CIESZYNSKI, Pawel KWIATKOWSKI
Life of this patent
Estimating the term…
Abstract
A method of providing an electrically conductive layer to a plastic splice housing for electromagnetically shielded cable harnesses includes providing an electrically conductive film and a mold, inserting the film into the mold, and injecting plastic into the mold so that the plastic bonds with the electrically conductive film, thereby forming an integrated conductive layer on the plastic housing suitable for electromagnetic shielding.
Claims18
A method of providing an electrically conductive layer to a plastic housing, in particular a splice housing for electromagnetically shielded cable harnesses, the method comprising the steps of:
- a) providing an electrically conductive film and a mold;
- b) inserting the film into the mold;
- and
- c) injecting plastic into the mold so that the plastic bonds with the electrically conductive film.
A splice housing for electromagnetically shielded cable harnesses, comprising two halves formed by a method comprising:
- a) providing an electrically conductive film and a mold;
- b) inserting the film into the mold;
- and
- c) injecting plastic into the mold so that the plastic bonds with the electrically conductive film.
A splice housing for an electromagnetically shielded cable harnesses, comprising:
- an outer housing made from injection molded plastic;
- and
- an interior conductive film, bonded to interior walls of the outer housing by an injection molding process.
Dependencies are inferred from the claim text.