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US 2026/0051675 A1Published application
Interconnection of printed circuit boards with nanowires
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsKlaus Haimlinger, Christian Hoelzl, Marco Gavagnin
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Abstract
A component carrier has an elongated shape and comprises a plurality of electrically conductive layer structures and at least one electrically insulating layer structure. At least two of said plurality of electrically conductive layer structures comprise and/or extend up to a respective area provided on one of two extremities of the elongated shape, wherein a plurality of conductive nanowires is provided on said respective areas.
Claims21
A component carrier,
- said component carrier having an elongated shape and comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure,
- at least two of said plurality of electrically conductive layer structures comprising and/or extending up to a respective area provided on one of two extremities of the elongated shape, wherein a plurality of conductive nanowires is provided on said respective areas.
Dependencies are inferred from the claim text.