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US 2026/0051646 A1Published application
Broadband sub-terahertz method for interconnecting dies and applications thereof
AssigneeQorvo US, Inc.
InventorAssaf Aviv Haviv
Life of this patent
Estimating the term…
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AssigneeQorvo US, Inc.
InventorAssaf Aviv Haviv
Estimating the term…
Aspects of the disclosure advantageously provide circuits and methods using the same in signal transmission. In some embodiments, a circuit includes a signal transmission line configured to transmit a signal between two ports, the signal transmission line comprising a first transmit portion coupled to a second transmit portion via a first interconnect stage and the second transmit portion coupled to a third transmit portion via a second interconnect stage, wherein the second transmit portion comprises a quarter wavelength transmission line having a length that is a quarter of a wavelength of the signal being transmitted between the two ports. In some embodiments, the first interconnect stage and the second interconnect stage each comprise a contact pad having identical, or substantially similar, shape and size.
A circuit comprising:
An electronic device, comprising:
A method for transmitting a signal, comprising:
Dependencies are inferred from the claim text.