Vibration absorbing apparatus for a semiconductor manufacturing apparatus

A vibration absorbing apparatus for semiconductor manufacturing apparatus, comprising:

• a base plate configured to be secured to a semiconductor manufacturing apparatus;
• a first beam structure including a first fixed end portion secured to the base plate and a first free end portion extending from the first fixed end portion;
• a second beam structure adjacent to the first beam structure and including a second fixed end portion secured to the base plate and a second free end portion extending from the second fixed end portion;
• a first mass body fastened to the first free end portion of the first beam structure;
• and
• a second mass body fastened to the second free end portion of the second beam structure,
• wherein the first mass body and the second mass body partially overlap each other, and the first mass body and the second mass body are configured to reduce vibrations at frequencies applied to the base plate by colliding with each other.

A vibration absorbing apparatus for semiconductor manufacturing apparatus, comprising:

• a base plate configured to be secured to a semiconductor manufacturing apparatus, the base plate having a first surface and a second surface facing each other;
• a first beam structure including a first fixed end portion secured to the first surface of the base plate and a first free end portion extending from the first fixed end portion and having a first slit formed along an extending direction;
• a second beam structure spaced apart from the first beam structure and including a second fixed end portion secured to the first surface of the base plate and a second free end portion extending from the second fixed end portion and having a second slit formed along the extending direction;
• a first mass body positioned along the first slit;
• and
• a second mass body positioned along the second slit and extending toward the first mass body such that the second mass body is at least partially overlapped with the first mass body,
• wherein the first mass body and the second mass body are configured to reduce vibrations at certain frequencies applied to the base plate by colliding with each other.