Substrate polishing device
AssigneeSamsung Electronics Co., Ltd.
InventorsJONGHA LIM, DONGHOON KWON
Life of this patent
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AssigneeSamsung Electronics Co., Ltd.
InventorsJONGHA LIM, DONGHOON KWON
Estimating the term…
A substrate polishing device includes: a plurality of wheels, the plurality of wheels comprising electromagnets; at least one belt comprising a first surface on a circumference of the plurality of wheels and a second surface opposite to the first surface and facing a polishing surface of the substrate, the at least one belt being configured to move based on rotation of the plurality of wheels; a magnetic field supplier configured to supply current to the electromagnets to generate a magnetic field in the plurality of wheels; at least one MRF supplier configured to supply the MRF onto the second surface of the at least one belt; a recovery structure configured to recover the MRF from the at least one belt; and a conditioner configured to filter the MRF recovered from the recovery structure and supply the filtered MRF to the at least one MRF supplier.
A substrate polishing device for polishing a substrate using a magnetorheological fluid (MRF), the substrate polishing device comprising:
A substrate polishing device for polishing a substrate using a magnetorheological fluid (MRF), the substrate polishing device comprising:
A substrate polishing device for polishing a substrate using a magnetorheological fluid (MRF), the substrate polishing device comprising:
Dependencies are inferred from the claim text.